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参数资料
| 型号： | RP-21203G1-800 |
| 厂商： | DATA DEVICE CORP |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, XMA20 |
| 封装： | PLASTIC, GULLWING LEAD PACKAGE-20 |
| 文件页数： | 2/20页 |
| 文件大小： | 228K |
| 代理商： | RP-21203G1-800 |
10
Data Device Corporation
www.ddc-web.com
RP-21200
D-02/04-0
low. Subsequently bringing the Control Command input to a
logic high will turn the SSPC on again.
THERMAL MEMORY
The I2t rating of a wire is based on the heating effect of current
passing through the wire with the assumption that the wire was
initially cool (unpowered). If a wire is already hot, its I2t rating is
lower and, if the wire is already at its maximum temperature, its
I2t rating is zero. The RP-21200 series has circuitry to create a
‘thermal memory’ to protect the wire under these conditions. The
I2t ratings of the
STAR Series shown in TABLE 3 apply only when
the load current prior to the overload is zero, such as when the
SSPC is first turned on. If the load was drawing current prior to
the overload, the trip time will be faster. If the SSPC tripped due
to an overload and the SSPC is commanded to turn back on
immediately, the trip will be almost instantaneous. However, if
the SSPC tripped due to an overload and sufficient time elapses
for the wire to cool, the trip time will once again be the same as
if the wire were initially unpowered. In this way, the ‘thermal
memory’ protects the wire from repetitive overloads.
STATUS CODES
This section contains a fuller explanation of the conditions and
meaning of the status codes shown in TABLE 6. Each paragraph
number corresponds to the STATE in TABLE 6.
The first four conditions show the control input has commanded
the SSPC to be off:
1) The SSPC has failed or shorted to ground. STATUS 1 indi-
cates the load is drawing current but the SSPC should be off.
2) The SSPC has failed. STATUS 1 indicates the load is drawing
current; STATUS 2 indicates the power MOSFET switch is on; the
SSPC should be off.
3) Normal off condition. STATUS 1 indicates the load is not draw-
ing current; STATUS 2 indicates the power MOSFET switch is off.
4) The SSPC has failed or STATUS 2 has shorted to the bias sup-
ply. STATUS 1 indicates the load is not drawing current; STATUS
2 indicates the power MOSFET is on; the SSPC should be off.
The next four conditions show the control input has commanded
the SSPC to be on:
5) The SSPC has failed or there is a short to ground on the STA-
TUS 2 output. STATUS 1 indicates the load is drawing current
but STATUS 2 indicates the power MOSFET switch is off.
6) Normal on condition. STATUS 1 indicates the load is drawing
current and STATUS 2 indicates the power MOSFET switch is on.
7) Tripped condition. STATUS 1 indicates the load is not drawing
current and STATUS 2 indicates the power MOSFET switch is
off. The SSPC can be turned back on by cycling the input con-
trol to a logic low and then back to a logic high. If the excessive
load has not been removed, the SSPC will trip again.
8) No load current. STATUS 1 indicates the load is not drawing
current; STATUS 2 indicates the power MOSFET switch is on.
HEATSINKING
The
STAR Series are designed so that the junction temperature
of its components can never exceed their maximum ratings if the
baseplate temperature is held to 100°C or less. Heat sinking
may be required at high ambient temperatures. The maximum
ambient temperature (Ta) for operation without a heat sink is
100 - Pd x
θ
CA (where Pd is the power dissipation and
θ
CA is the
thermal resistance from case-to-ambient from TABLE 3). Note
that TABLE 4 specifies maximum power dissipation assuming
maximum baseplate temperature and a current equal to Rated
Current. Since all systems are designed for the maximum load
current to be less than the SSPC’s Rated Current (for margin),
the actual power would be less than shown in TABLE 4. For
example, an SSPC with a Rated Current of 25 Amps, operated
at a maximum load current of 20 Amps would actually dissipate
4.95 Watts (20 x 20 x 0.012 + 0.15). This is almost 36% less than
the maximum specified in TABLE 4.
Similarly, if the maximum baseplate temperature will be less than
100°C, the MOSFET switch’s ‘on’ resistance will be less than the
maximum, thereby reducing the power dissipation. As a result,
in many cases, a heat sink will not be required. But, operating at
maximum load currents and maximum baseplate temperatures
will always require a heat sink. The maximum baseplate tem-
perature with a heat sink can be calculated using the same for-
mula as for without a heat sink, except that
θ
CA is replaced by the
sum of the thermal resistance from junction-to-baseplate and
baseplate-to-heat sink.
Notes:
1) STATUS 1 indicates a logic low when the load is greater than programmed
load detection value. See FIGURE 4.
2) STATUS 2 indicates a logic high when the Power MOSFET switch is on.
3) Any trip condition per FIGURE 5.
4) Input Control=Control Command and Lockout Input.
Normal power out
with load less than
programmed load
detection value
H
8
Load “on”; showing
normal “on” condition.
H
L
H
6
Load “off”; showing
“trip” (see note 3).
L
H
7
SSPC failure or
short to ground on
STATUS 2 line.
L
H
5
SSPC failure or
STATUS 2 shorted
to bias supply
H
L
4
Load “off”; showing
normal “off” condition.
L
H
L
3
Load “on”; showing
SSPC failure.
H
L
2
SSPC failure or
short to ground.
L
1
POWER
CONTROLLER AND
LOAD STATUS
OUTPUT
STATUS 2
(see note 2)
OUTPUT
STATUS 1
(see note 1)
INPUT
CONTROL
(see note 4)
STATE
TABLE 6. STATUS CODES
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