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参数资料
| 型号： | RP-21203G1-800 |
| 厂商： | DATA DEVICE CORP |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, XMA20 |
| 封装： | PLASTIC, GULLWING LEAD PACKAGE-20 |
| 文件页数： | 6/20页 |
| 文件大小： | 228K |
| 代理商： | RP-21203G1-800 |
14
Data Device Corporation
www.ddc-web.com
RP-21200
D-02/04-0
L1
L2
L3
ST
AR
Series
TM
RP
- 212XXXX
- XXX
S/N
0201
9861
(USA)
20
3
1
2
ISOMETRIC TOP VIEW
[FLAT PACKAGE (F) SHOWN]
A
0.05
(1.27)
0.675
(17.15)
0.675 (17.1)
0.25
(6.35)
B
D
17 equal spaces
@ 0.075 = 1.275 (32.39)
E
MOUNTING HOLES
CONTROL TERMINALS
POWER TERMINALS
0.02
(0.51)
Internal 4-40 THD X 5/64 Deep
(2 PLACES) captive nuts not to
protrude bottom
0.160
(4.06)
0.800
(20.3)
Pin 1
Pin 2
Pin 20
Pin 3
A
C
Recommended thermal pad thickness = 0.020 (0.51)
Tie Bar
(
)
BOTTOM VIEW
[FLAT PACKAGE (F) SHOWN]
ALTERNATE LEAD CONFIGURATIONS
[GULL LEAD (G) AND
THROUGH HOLE (D) PACKAGES SHOWN]
0.08 Ref. (2.03)
0.09 (2.29)
0.04 min. flat
(1.02)
Both Sides
0.17
(4.32)
0.17
Ref
(4.32)
.19 (TYP)
(4.83)
LEADS MAY BE FORMED
ALTERNATIVELY FOR PLUG-IN
.230 min.
(5.84)
F
G
H
Tie Bar
0.02(TYP)
( 0.51)
Both Sides
0.020
(0.51)
Both Sides
FIGURE 8. RP-21200 SERIES MECHANICAL OUTLINE
PACKAGE DIMENSIONS
SSPC MODEL
RP-21203
RP-21209
RP-21225
L1 (see Note 1)
1.205 (30.61)
1.500 (38.10)
1.505 (38.23)
L2 (see Note 1)
1.505 (38.23)
1.500 (38.10)
2.205 (55.88)
L3 (see Note 2)
0.460 (11.68)
A
0.262 (6.65)
0.125 (3.18)
B
0.630 (16.00)
0.930 (23.62)
1.250 (31.75)
C
0.930 (23.62)
1.950 (49.53)
D
0.115 (2.92)
0.112 (2.84)
0.425 (10.80)
E
0.260 (6.60)
0.505 (12.83)
F
1.54 ±0.01 (39.12)
1.84 ±0.01(46.74)
1.84 ±0.01 (46.74)
G
1.205 (30.61)
1.50 (38.10)
1.505 (38.10)
H
Notes:
- The models listed above are available with and without the analog current output option.
- Dimensions are in inches (mm).
1. Typical dimensions; tolerance is ± 0.005 in (±0.127).
2. Max. dimensions.
1.38 ±0.01 (35.05)
1.68 ±0.01 (42.67)
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