参数资料
型号: S29GL032M10BAIR60
厂商: SPANSION LLC
元件分类: PROM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封装: 8 X 6 MM, BGA-48
文件页数: 66/110页
文件大小: 4891K
代理商: S29GL032M10BAIR60
December 13, 2005 S29GL-M_00_B5
S29GL-M MirrorBitTM Flash Family
57
Data
Sheet
Note that if a Write Buffer address location is loaded multiple times, the address/data pair counter
is decremented for every data load operation. The host system must therefore account for loading
a write-buffer location more than once. The counter decrements for each data load operation, not
for each unique write-buffer-address location. Note also that if an address location is loaded more
than once into the buffer, the final data loaded for that address is programmed.
Once the specified number of write buffer locations are loaded, the system must then write the
Program Buffer to Flash command at the sector address. Any other address and data combination
aborts the Write Buffer Programming operation. The device then begins programming. Data poll-
ing should be used while monitoring the last address location loaded into the write buffer. DQ7,
DQ6, DQ5, and DQ1 should be monitored to determine the device status during Write Buffer
Programming.
The write-buffer programming operation can be suspended using the standard program suspend/
resume commands. Upon successful completion of the Write Buffer Programming operation, the
device is ready to execute the next command.
The Write Buffer Programming Sequence can be aborted in the following ways:
Load a value that is greater than the page buffer size during the Number of Locations to Pro-
gram step.
Write to an address in a sector different than the one specified during the Write-Buffer-Load
command.
Write an Address/Data pair to a different write-buffer-page than the one selected by the
Starting Address during the write buffer data loading stage of the operation.
Write data other than the Confirm Command after the specified number of data load cycles.
The abort condition is indicated by DQ1 = 1, DQ7 = DATA# (for the last address location loaded),
DQ6 = toggle, and DQ5=0. A Write-to-Buffer-Abort Reset command sequence must be written to
reset the device for the next operation.
Note that the Secured Silicon Sector, autoselect, and CFI functions are unavailable when a pro-
gram operation is in progress. This flash device is capable of handling multiple write buffer
programming operations on the same write buffer address range without intervening erases. For
applications requiring incremental bit programming, a modified programming method is required;
please contact your local Spansion representative. Any bit in a write buffer address range
cannot be programmed from “0” back to a “1.” Attempting to do so can cause the device to
set DQ5=1, of cause the DQ7 and DQ6 status bits to indicate the operation was successful. How-
ever, a succeeding read shows that the data is still “0.” Only erase operations can convert a “0”
to a “1.”
Accelerated Program
The device offers accelerated program operations through the WP#/ACC or ACC pin depending
on the particular product. When the system asserts VHH on the WP#/ACC or ACC pin. The device
uses the higher voltage on the WP#/ACC or ACC pin to accelerate the operation. Note that the
WP#/ACC pin must not be at VHH for operations other than accelerated programming, or device
damage can result. WP# has an internal pullup; when unconnected, WP# is at VIH.
Figure 3 illustrates the algorithm for the program operation. See Erase and Program Operations-
S29GL032M Only and AC Characteristics for parameters, and Figure 14 for timing diagrams.
相关PDF资料
PDF描述
S29GL032M10BAIR62 MirrorBit Flash Family
S29GL032M10BFIR52 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 8.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR53 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR60 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR62
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