参数资料
型号: S29GL032M10BAIR60
厂商: SPANSION LLC
元件分类: PROM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封装: 8 X 6 MM, BGA-48
文件页数: 81/110页
文件大小: 4891K
代理商: S29GL032M10BAIR60
70
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B5 December 13, 2005
Data
Sheet
Figure 8 shows the toggle bit algorithm in flowchart form, and the section “DQ2: Toggle Bit II”
explains the algorithm, also see RY/BY#: Ready/Busy#. Figure 20 shows the toggle bit timing di-
agram. Figure 21 shows the differences between DQ2 and DQ6 in graphical form.
Whenever the system initially begins reading toggle bit status, it must read DQ7–DQ0 at least
twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and
store the value of the toggle bit after the first read. After the second read, the system would com-
pare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has
completed the program or erase operation. The system can read array data on DQ7–DQ0 on the
following read cycle.
However, if after the initial two read cycles, the system determines that the toggle bit is still tog-
gling, the system also should note whether the value of DQ5 is high (see the section on DQ5). If
it is, the system should then determine again whether the toggle bit is toggling, since the toggle
bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the
device has successfully completed the program or erase operation. If it is still toggling, the device
did not completed the operation successfully, and the system must write the reset command to
return to reading array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and
DQ5 did not go high. The system may continue to monitor the toggle bit and DQ5 through suc-
cessive read cycles, determining the status as described in the previous paragraph. Alternatively,
it may choose to perform other system tasks. In this case, the system must start at the beginning
of the algorithm when it returns to determine the status of the operation (top of Figure 6).
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program, erase, or write-to-buffer time exceeded a specified internal
pulse count limit. Under these conditions DQ5 produces a “1,” indicating that the program or erase
cycle was not successfully completed.
The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was
previously programmed to “0.” Only an erase operation can change a “0” back to a “1.”
Under this condition, the device halts the operation, and when the timing limit is exceeded, DQ5
produces a “1.”
In all these cases, the system must write the reset command to return the device to the reading
the array (or to erase-suspend-read if the device was previously in the erase-suspend-program
mode).
DQ3: Sector Erase Timer
After writing a sector erase command sequence, the system may read DQ3 to determine whether
or not erasure started. (The sector erase timer does not apply to the chip erase command.) If
additional sectors are selected for erasure, the entire time-out also applies after each additional
sector erase command. When the time-out period is complete, DQ3 switches from a “0” to a “1.”
If the time between additional sector erase commands from the system can be assumed to be
less than 50 s, the system need not monitor DQ3(see Sector Erase Command Sequence).
After the sector erase command is written, the system should read the status of DQ7 (Data# Poll-
ing) or DQ6 (Toggle Bit I) to ensure that the device accepted the command sequence, and then
reads DQ3. If DQ3 is “1,” the Embedded Erase algorithm started; all further commands (except
Erase Suspend) are ignored until the erase operation is complete. If DQ3 is “0,” the device accepts
additional sector erase commands. To ensure the command was accepted, the system software
should check the status of DQ3 prior to and following each subsequent sector erase command. If
DQ3 is high on the second status check, the last command might not have been accepted.
Table 37 shows the status of DQ3 relative to the other status bits.
相关PDF资料
PDF描述
S29GL032M10BAIR62 MirrorBit Flash Family
S29GL032M10BFIR52 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 8.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR53 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR60 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR62
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