参数资料
型号: S29GL032M10TAIR02
厂商: SPANSION LLC
元件分类: PROM
英文描述: MirrorBit Flash Family
中文描述: 4M X 8 FLASH 3V PROM, 100 ns, PDSO40
封装: MO-142-EC, TSOP-40
文件页数: 35/160页
文件大小: 4727K
代理商: S29GL032M10TAIR02
April 30, 2004 S29GLxxxM_00A5
S29GLxxxM MirrorBitTM Flash Family
13
Pre l i m i n a r y
Connection Diagrams
Notes:
1. Ball H7 is VIO on S29GL064M (model R5).
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
C2
D2
E2
F2
G2
H2
J2
K2
C3
D3
E3
F3
G3
H3
J3
K3
C4
D4
E4
F4
G4
H4
J4
K4
C5
D5
E5
F5
G5
H5
J5
K5
C6
D6
E6
F6
G6
H6
J6
K6
C7
D7
A7
B7
A8
B8
A1
B1
A2
E7
F7
G7
H7
J7
K7
L7
L8
M7
M8
L1
L2
M1
M2
NC*
DQ15/A-1
VSS
BYTE#
1
A16
A15
A14
A12
A13
DQ13
DQ6
DQ14
DQ7
A11
A10
A8
A9
VCC
DQ4
DQ12
DQ5
A19
A21
RESET#
WE#
DQ11
DQ3
DQ10
DQ2
A20
A18
WP#/ACC
RY/BY#
DQ9
DQ1
DQ8
DQ0
A5
A6
A17
A7
OE#
VSS
CE#
A0
A1
A2
A4
A3
* Balls are shorted together via the substrate but not connected to the die.
63-Ball Fine-Pitch BGA
Top View, Balls Facing Down
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