参数资料
型号: S29GL032M10TAIR40
厂商: SPANSION LLC
元件分类: PROM
英文描述: CAP 1.0UF 500V 10% X7R RAD-.475 .570X.500 CONF BULK
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PDSO48
封装: MO-142EC, TSOP-48
文件页数: 28/116页
文件大小: 6024K
代理商: S29GL032M10TAIR40
February 7, 2007 S29GL-M_00_B8
S29GL-M MirrorBitTM Flash Family
17
Data
Sheet
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
Table 1. S29GL032M Ordering Options
S29GL032M Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL032M
90
TAC,TFC
R0
0,2,3
TS040 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
TAC,TFC
R1,R2
TS056 (2, 3, 5)
TSOP
FAC,FFC
LAA064 (4)
Fortified BGA
TAC,TFC
R3,R4
TS048 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
FAC,FFC
LAA064 (4)
Fortified BGA
90, 10, 11
TAI,TFI
R0
TS040 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
TAI,TFI
R1,R2
TS056 (2, 3, 5)
TSOP
FAI,FFI
LAA064 (4)
Fortified BGA
TAI,TFI
R3,R4
TS048 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
FAI,FFI
LAA064 (4)
Fortified BGA
TBI,TCI
FPT-48P-M19 (3, 6)
TSOP
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