参数资料
| 型号： | SA5212AD,602 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 8/20页 |
| 文件大小： | 0K |
| 描述： | IC TRANSIMP AMP 140MHZ 8-SOIC |
| 标准包装： | 100 |
| 放大器类型： | 转阻 |
| 电路数： | 1 |
| 输出类型： | 差分 |
| -3db带宽： | 140MHz |
| 电流 - 电源： | 26mA |
| 电流 - 输出 / 通道： | 4mA |
| 电压 - 电源，单路/双路(±)： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
| 其它名称： | 568-1198-5 935028520602 SA5212AD |
Philips Semiconductors
Product specification
SA5212A
Transimpedance amplifier (140MHz)
1998 Oct 07
16
1
2
3
4
5
6
7
8
GND1
OUT+
GND2
OUT–
GND2
IIN
VCC
ECN No.: 99918
1990 Jul 5
SD00489
Figure 18. SA5212A Bonding Diagram
Die Sales Disclaimer
Due to the limitations in testing high frequency and other parameters
at the die level, and the fact that die electrical characteristics may
shift after packaging, die electrical parameters are not specified and
die are not guaranteed to meet electrical characteristics (including
temperature range) as noted in this data sheet which is intended
only to specify electrical characteristics for a packaged device.
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25
°C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SA5212AFE | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Transimpedance amplifier 140MHz |
| SA5212AN | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Transimpedance amplifier 140MHz |
| SA5213SLK | 功能描述:开发板和工具包 - COLDFIRE COLDFIRE M5213 STUDENT RoHS:否 制造商:Freescale Semiconductor 产品:Development Kits 工具用于评估:MCF53017 核心:ColdFire V3 接口类型:Ethernet, UART, USB 工作电源电压:12 V |
| SA5214 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Postamplifier with link status indicator |
| SA5214D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Postamplifier with link status indicator |
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