参数资料
型号: SAK-XC866-1FRA3V
厂商: INFINEON TECHNOLOGIES AG
元件分类: 微控制器/微处理器
英文描述: 8-BIT, FLASH, 26.7 MHz, MICROCONTROLLER, PDSO38
封装: PLASTIC, GREEN, TSSOP-38
文件页数: 17/116页
文件大小: 1640K
代理商: SAK-XC866-1FRA3V
XC866
Package and Reliability
Data Sheet
109
V1.2, 2007-10
5
Package and Reliability
5.1
Package Parameters (PG-TSSOP-38)
Table 47 provides the thermal characteristics of the package.
Table 47
Thermal Characteristics of the Package
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Thermal resistance junction
case1)
1)
The thermal resistances between the case and the ambient (RTCA) , the lead and the ambient (RTLA) are to
be combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead
(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: TJ=TA +RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
RTJC CC
15.7
K/W –
Thermal resistance junction
lead1)
RTJL CC
39.2
K/W –
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SAK-XC866-1FRA 8-BIT, FLASH, 26.7 MHz, MICROCONTROLLER, PDSO38
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