参数资料
型号: SAX-XC878M-16FFI5V
厂商: INFINEON TECHNOLOGIES AG
元件分类: 微控制器/微处理器
英文描述: 8-BIT, FLASH, 24 MHz, RISC MICROCONTROLLER, PQFP64
封装: PLASTIC, TQFP-64
文件页数: 44/141页
文件大小: 2385K
代理商: SAX-XC878M-16FFI5V
XC878CLM
Package and Quality Declaration
Data Sheet
133
V1.1, 2009-08
5
Package and Quality Declaration
Chapter 5 provides the information of the XC878 package and reliability section.
5.1
Package Parameters
Table 1 provides the thermal characteristics of the PG-LQFP-64-4 package used in
XC878.
Table 1
Thermal Characteristics of the Packages
Parameter
Symbol
Limit Values
Unit
Notes
Min.
Max.
Thermal resistance junction
case1)
1) The thermal resistances between the case and the ambient (
RTCA) , the lead and the ambient (RTLA) are to be
combined with the thermal resistances between the junction and the case (
RTJC), the junction and the lead
(
RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(
RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
TJ=TA+RTJA × PD, where the RTJA is
the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
R
TJC
CC -
13.8
K/W
-
Thermal resistance junction
R
TJL
CC -
34.6
K/W
-
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