- 您现在的位置：买卖IC网 > PDF目录11813 > SC16C2550IB48,157 (NXP Semiconductors)IC DUART SOT313-2 PDF资料下载
参数资料
| 型号： | SC16C2550IB48,157 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 38/46页 |
| 文件大小： | 0K |
| 描述： | IC DUART SOT313-2 |
| 标准包装： | 1,250 |
| 特点： | 2 通道 |
| 通道数： | 2，DUART |
| FIFO's： | 16 字节 |
| 电源电压： | 2.5V，3.3V，5V |
| 带自动流量控制功能： | 是 |
| 带IrDA 编码器/解码器： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 带CMOS： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-LQFP（7x7） |
| 包装： | 管件 |
| 其它名称： | 935270020157 SC16C2550IB48 SC16C2550IB48-ND |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页当前第38页第39页第40页第41页第42页第43页第44页第45页第46页
Philips Semiconductors
SC16C2550
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
encoder/decoder
Product data
Rev. 03 — 19 June 2003
43 of 46
9397 750 11621
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 235
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
12.3.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°C or
265
°C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ux will eliminate the need for removal of corrosive residues in
most applications.
12.3.3
Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
相关PDF资料 |
PDF描述 |
|---|---|
| SC16C2550IA44,518 | IC DUART SOT187-2 |
| SC16C2550IA44,512 | IC DUART SOT187-2 |
| VI-B7N-IX-F1 | CONVERTER MOD DC/DC 18.5V 75W |
| SC16C2550BIN40,112 | IC UART DUAL W/FIFO 40-DIP |
| VI-B7N-IW-F4 | CONVERTER MOD DC/DC 18.5V 100W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C2550IN40 | 制造商:PHILIP 功能描述: |
| SC16C2550IN40,112 | 功能描述:IC UART DUAL W/FIFO 40-DIP RoHS:是 类别:集成电路 (IC) >> 接口 - UART（通用异步接收器/发送器） 系列:- 标准包装:250 系列:- 特点:* 通道数:2，DUART FIFO's:16 字节 规程:RS232，RS485 电源电压:2.25 V ~ 5.5 V 带并行端口:- 带自动流量控制功能:是 带IrDA 编码器/解码器:是 带故障启动位检测功能:是 带调制解调器控制功能:是 带CMOS:是 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:托盘 其它名称:XR16L2551IM-F-ND |
| SC16C2552 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual UART with 16-byte transmit and receive FIFOs |
| SC16C2552B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs |
| SC16C2552BIA44 | 功能描述:UART 接口集成电路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。