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| 型号： | SC16C2550IB48,157 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 39/46页 |
| 文件大小： | 0K |
| 描述： | IC DUART SOT313-2 |
| 标准包装： | 1,250 |
| 特点： | 2 通道 |
| 通道数： | 2，DUART |
| FIFO's： | 16 字节 |
| 电源电压： | 2.5V，3.3V，5V |
| 带自动流量控制功能： | 是 |
| 带IrDA 编码器/解码器： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 带CMOS： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-LQFP（7x7） |
| 包装： | 管件 |
| 其它名称： | 935270020157 SC16C2550IB48 SC16C2550IB48-ND |
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Philips Semiconductors
SC16C2550
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
encoder/decoder
Product data
Rev. 03 — 19 June 2003
44 of 46
9397 750 11621
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
12.4 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[4]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[5]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[6]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[7]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[8]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
13. Revision history
Table 27:
Suitability of IC packages for wave, reow and dipping soldering methods
Mounting
Package[1]
Soldering method
Wave
Reow[2]
Dipping
Through-hole
mount
DBS, DIP, HDIP, SDIP, SIL suitable[3]
suitable
Surface mount
BGA, LBGA, LFBGA,
SQFP, SSOP-T[4],
TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable[5]
suitable
PLCC[6], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[6][7]
suitable
SSOP, TSSOP, VSO,
VSSOP
not recommended[8]
suitable
Table 28:
Revision history
Rev Date
CPCN
Description
03
20030619
-
Product data (9397 750 11621). ECN 853-2368 30033 of 16 June 2003.
Modications:
Figure 5 “Crystal oscillator connection.” on page 13: changed capacitors’ values and
added connection with resistor.
02
20030314
-
Product data (9397 750 11204). ECN 853-2368 29624 of 07 March 2003.
01
20020904
-
Product data (9397 750 08831). ECN 853-2368 28865 of 04 September 2002.
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| VI-B7N-IX-F1 | CONVERTER MOD DC/DC 18.5V 75W |
| SC16C2550BIN40,112 | IC UART DUAL W/FIFO 40-DIP |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C2550IN40 | 制造商:PHILIP 功能描述: |
| SC16C2550IN40,112 | 功能描述:IC UART DUAL W/FIFO 40-DIP RoHS:是 类别:集成电路 (IC) >> 接口 - UART（通用异步接收器/发送器） 系列:- 标准包装:250 系列:- 特点:* 通道数:2，DUART FIFO's:16 字节 规程:RS232，RS485 电源电压:2.25 V ~ 5.5 V 带并行端口:- 带自动流量控制功能:是 带IrDA 编码器/解码器:是 带故障启动位检测功能:是 带调制解调器控制功能:是 带CMOS:是 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:托盘 其它名称:XR16L2551IM-F-ND |
| SC16C2552 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual UART with 16-byte transmit and receive FIFOs |
| SC16C2552B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs |
| SC16C2552BIA44 | 功能描述:UART 接口集成电路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
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