参数资料
| 型号： | SC16C752IB48,128 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 38/47页 |
| 文件大小： | 0K |
| 描述： | IC DUAL UART 64BYTE 48LQFP |
| 标准包装： | 1 |
| 通道数： | 2，DUART |
| FIFO's： | 64 字节 |
| 电源电压： | 2.5V，3.3V，5V |
| 带自动流量控制功能： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-LQFP（7x7） |
| 包装： | 标准包装 |
| 其它名称： | 568-5955-6 |
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Philips Semiconductors
SC16C752
Dual UART with 64-byte FIFO
Product data
Rev. 04 — 20 June 2003
43 of 47
9397 750 11635
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for ne pitch SMDs. In
these situations reow soldering is recommended. In these situations reow
soldering is recommended.
13.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 220
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA and SSOP-T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 235
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C754 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Quad UART with 64-byte FIFO |
| SC16C754B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs |
| SC16C754BIA68 | 功能描述:UART 接口集成电路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C754BIA68,512 | 功能描述:UART 接口集成电路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C754BIA68,518 | 功能描述:UART 接口集成电路 4CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
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