参数资料
| 型号： | SC174MLTRT |
| 厂商： | Semtech |
| 文件页数： | 20/27页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 4A 10MLPD |
| 产品培训模块： | Power Supplies 101 |
| 标准包装： | 1 |
| 系列： | EcoSpeed® |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.75 V ~ 5.23 V |
| 输入电压： | 3 V ~ 5.5 V |
| 频率 - 开关： | 200kHz ~ 1MHz |
| 电流 - 输出： | 4A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-VFDFN 裸露焊盘 |
| 包装： | 标准包装 |
| 供应商设备封装： | 10-MLPD（3x3） |
| 其它名称： | SC174MLDKR |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页当前第20页第21页第22页第23页第24页第25页第26页第27页
SC174
Layout Guideline
V IN +
R1
V IN -
V O +
C4
C3
C11
C2
C1
0
L1
C5
0
1 1
2 2
3 3
4 4
5 5
SC174
U1
BST VDD
VIN AGND
LX TON
PGND EN/PSV
PGOOD FB
10
9 9
8
7 7
6 6
C10
C 6
R2
EN/PSV
V O -
C7
R3
R6
R7
0
0
R4
C8
C9
0
Schematic for layout illustration
Since the SC174 has integrated switches, special consid-
eration should be given to board layout. Let us use the
schematic shown above as an example. The board level
layout is illustrated in the following four layers.
As shown on the top layer layout, U1 is the switching
regulator SC174. C1 and C11 serve as the decoupling ca-
pacitor for the buck converter power train. C11, with a
value between 1nF and 10nF, is the high frequency filter-
ing capacitor. It is recommended to put C1 and C11 as
close as possible to the SC174 to get the best decoupling
performance, with C11 closest. C1, with a value of 10uF,
should be placed no more than 3mm away from the VIN
pin. L1 is the output filtering inductor. C2, C3 and C4 are
the output filtering capacitors. C5 is the boostrap capaci-
tor. Pin 10 (VDD) is the input bias power for the internal
circuits. It is recommended to get the power from VIN
through an RC filtering network consisted of R1, C6 and
C10. The value of R1 can be between 3.01 W and 10 W and
the capacitance of C10 should be above 1 m F. C6, with a
value of 1nF, is the high frequency filtering capacitor. The
? 2010 Semtech Corporation
locations of C6 and C10 should be as close as possible to
pins 9 and 10, with C6 closest, to get the best possible
filtering result. R2 is the on-time programming resistor.
R2 should be located as close as possible to pin 8 and it
should return to analog ground. The EN/PSV pin is a tri-
state pin. Pull EN/PSV high to enable the part with power
save mode enabled. Connect EN/PSV to AGND to disable
the switching regulator. Leave EN/PSV floating to enable
the IC in forced continuous conduction mode.
Since there are two integrated MOSFETs inside the SC174
that will dissipate a lot of power, to help spread the heat
out of the IC more efficiently, there is a thermal pad un-
derneath the SC174 serving as a heat sink. To enlarge the
heat sinking area, a large copper plane under the thermal
pad as shown on the top layer is recommended.
On inner layer 2, a large analog ground plane (AGND) on
the right hand side is connected to the thermal pad un-
derneath the SC174 using vias. Thus the heat generated
inside the SC174 can be spread through the vias to the
20
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