参数资料
| 型号： | SCC2681AC1N40,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 25/29页 |
| 文件大小： | 0K |
| 描述： | IC UART DUAL 40-DIP |
| 产品培训模块： | Stand-Alone UARTs |
| 标准包装： | 9 |
| 特点： | 故障启动位检测 |
| 通道数： | 2，DUART |
| FIFO's： | 3 位 |
| 电源电压： | 5V |
| 带并行端口： | 是 |
| 带自动流量控制功能： | 是 |
| 带故障启动位检测功能： | 是 |
| 带CMOS： | 是 |
| 安装类型： | 通孔 |
| 封装/外壳： | 40-DIP（0.600"，15.24mm） |
| 供应商设备封装： | 40-DIP |
| 包装： | 管件 |
| 其它名称： | 568-3525-5 935274523112 SCC2681AC1N40 |
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Philips Semiconductors
Product data
SCC2681
Dual asynchronous receiver/transmitter (DUART)
2004 Apr 06
5
ABSOLUTE MAXIMUM RATINGS1
SYMBOL
PARAMETER
RATING
UNIT
Tamb
Operating ambient temperature range2
See Note 4
°C
Tstg
Storage temperature range
–65 to +150
°C
All voltages with respect to ground3
–0.5 to +6.0
V
Pin voltage range
VSS – 0.5 V to VCC + 0.5 V
V
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other condition above those indicated in the operation section of this specification is not
implied.
2. For operating at elevated temperatures, the device must be derated based on +150
°C maximum junction temperature.
3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.
4. Parameters are valid over specified temperature range. See Ordering information table for applicable operating temperature range and VCC
supply range.
DC ELECTRICAL CHARACTERISTICS1, 2, 3
Tamb = –40 °C to +85 °C; VCC = +5.0 V ± 10%
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
TEST CONDITIONS
Min
Typ
Max
UNIT
VIL
LOW-level input voltage
–
0.8
V
VIH
HIGH-level input voltage (except X1/CLK)
Tamb ≥ 0 °C
2.0
–
V
VIH
HIGH-level input voltage (except X1/CLK)
Tamb < 0 °C
2.5
–
V
VIH
HIGH-level input voltage (X1/CLK)
0.8 VCC
–
V
VOL
LOW-level output voltage
IOL = 2.4 mA
–
0.4
V
VOH
HIGH-level output voltage (except open-drain outputs)4
IOH = –400 A
VCC – 0.5
–
V
IIX1
X1/CLK input current
VIN = 0 V to VCC
–10
–
+10
A
IILX1
X1/CLK input LOW current – operating
VIN = 0 V
–75
–
0
A
IIHX1
X1/CLK input HIGH current – operating
VIN = VCC
0
–
75
A
IOHX2
X2 output HIGH current – operating
VOUT = VCC; X1 = 0
0
–
+75
A
IOHX2S
X2 output HIGH short circuit current – operating
VOUT = 0 V; X1 = 0
–10
–
–1
mA
IOLX2
X2 output LOW current – operating
VOUT = 0 V; X1 = VCC
–75
–
0
A
IOLX2S
X2 output LOW short circuit current – operating
VOUT = VCC; X1 = VCC
1
–
10
mA
Input leakage current:
II
All except input port pins
VIN = 0 V to VCC
–10
–
+10
A
Input port pins
VIN = 0 V to VCC
–20
–
+10
A
IOZH
Output off current HIGH, 3-state data bus
VIN = VCC
–
10
A
IOZL
Output off current LOW, 3-state data bus
VIN = 0 V
–10
–
A
IODL
Open-drain output LOW current in off-state
VIN = 0 V
–10
–
A
IODH
Open-drain output HIGH current in off-state
VIN = VCC
–
10
A
ICC
Power supply current5
ICC
Operating mode
CMOS input levels
–
10
mA
NOTES:
1. Parameters are valid over specified temperature range.
2. All voltage measurements are referenced to ground (GND). For testing, all inputs swing between 0.4 V and 2.4 V with a transition time of
5 ns maximum. For X1/CLK this swing is between 0.4 V and 4.4 V. All time measurements are referenced at input voltages of 0.8 V and
2.0 V and output voltages of 0.8 V and 2.0 V, as appropriate.
3. Typical values are at +25
°C, typical supply voltages, and typical processing parameters.
4. Test conditions for outputs: CL = 150 pF, except interrupt outputs. Test conditions for interrupt outputs: CL = 50 pF, RL = 2.7 k to VCC.
5. All outputs are disconnected. Inputs are switching between CMOS levels of VCC – 0.2 V and VSS + 0.2 V.
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