参数资料
型号: SCDV5540
厂商: SIEMENS A G
元件分类: 显示用LED
英文描述: 5X5 DOT MATRIX DISPLAY, RED, 3.2 mm
封装: PLASTIC, DIP-14
文件页数: 14/14页
文件大小: 180K
代理商: SCDV5540
9
SCDV5540/1/2/3/4
Figure 10. Row strobing
Multiplexer and Display Driver
The four characters are row multiplexed with RAM resident col-
umn data. The strobe rate is established by the internal or
external MUX Clock rate. The MUX Clock frequency is divided
by a 320 counter chain. This results in a typical strobe rate of
750 Hz. By pulling the Clock SEL line low, the display can be
operated from an external MUX Clock. The external clock is
attached to the CLK I/O connection (pin 8). The maximum
external MUX Clock frequency should be limited to 1 MHz.
An asynchronous hardware Reset (pin 9) is also provided. Bring-
ing this pin low will clear the Character Address Register, Con-
trol Word Register, RAM, and blanks the display. This action
leaves the display set at Character Address 0, and the Bright-
ness Level set at 100%.
Electrical & Mechanical Considerations
Interconnect Considerations
Optimum product performance can be had when the following
electrical and mechanical recommendations are adopted. The
SCDV554X’s IC is constructed in a high speed CMOS process,
consequently high speed noise on the SERIAL DATA, SERIAL
DATA CLOCK, LOAD and RESET lines may cause incorrect data
to be written into the serial shift register. Adhere to transmis-
sion line termination procedures when using fast line drivers
and long cables (>10 cm).
Good digital grounds (pins 7 and 14) and power supply decou-
pling (pins 11 and 12) will insure that ICC (<400 mA peak)
switching currents do not generate localized ground bounce.
Therefore it is recommended that each display package use a
0.1
F and 20 F capacitor between V
CC and ground.
When the internal MUX Clock is being used connect the
CLKSEL pin to VCC. In those applications where RESET will not
be connected to the system’s reset control, it is recommended
that this pin be connected to the center node of a series 0.1,
F
and 100 K
RC network. Thus upon initial power up the RESET
will be held low for 10 ms allowing adequate time for the sys-
tem power supply to stabilize.
LOAD ROW 0
ROW LOAD
Column
0
Column
1
Column
2
Column
3
Column
4
Row 0
Row 1
Row 2
Row 3
Row 4
Row 0
Row 1
Row 2
Row 3
Row 4
Row 0
Row 1
Row 2
Row 3
Row 4
Row 0
Row 1
Row 2
Row 3
Row 4
Column
0
Column
1
Column
2
Column
3
Column
4
Column
0
Column
1
Column
2
Column
3
Column
4
Column
0
Column
1
Column
2
Column
3
Column
4
LOAD ROW 1
LOAD ROW 2
LOAD ROW 3
Row 0
Row 1
Row 2
Row 3
Row 4
LOAD ROW 4
Column
0
Column
1
Column
2
Column
3
Column
4
ESD Protection
The input protection structure of the SCDV5540/1/2/3/4 pro-
vides signicant protection against ESD damage. It is capable of
withstanding discharges greater than 2 KV. Take all the standard
precautions, normal for CMOS components. These include
properly grounding personnel, tools, tables, and transport carri-
ers that come in contact with unshielded parts. If these condi-
tions are not, or cannot be met, keep the leads of the device
shorted together or the parts in anti-static packaging.
Soldering Considerations
The SCDV5540/1/2/3/4 can be hand soldered with SN63 solder
using a grounded iron set to 260
°C.
Wave soldering is also possible following these conditions: Pre-
heat that does not exceed 93
°C on the solder side of the PC
board or a package surface temperature of 85
°C. Water soluble
organic acid ux (except carboxylic acid) or resin-based RMA
ux without alcohol can be used.
Wave temperature of 245
°C ±5°C with a dwell between 1.5 sec.
to 3.0 sec. Exposure to the wave should not exceed tempera-
tures above 260
°C for ve seconds at 0.063" below the seating
plane. The packages should not be immersed in the wave.
Post Solder Cleaning Procedures
The least offensive cleaning solution is hot D.I. water (60
°C) for
less than 15 minutes. Addition of mild saponiers is acceptable.
Do not use commercial dishwasher detergents.
For faster cleaning, solvents may be used. Exercise care in
choosing solvents as some may chemically attack the nylon
package. For further information refer to Appnotes 18 and 19 in
the current Siemens Optoelectronic Data Book. See Appnote
19, Table 2, “Displays–Group 2” for the SCDV554X.
An alternative to soldering and cleaning the display modules is
to use sockets. Naturally, 14 pin DIP sockets .300" wide with
.100" centers work well for single displays. Multiple display
assemblies are best handled by longer SIP sockets or DIP sock-
ets when available for uniform package alignment. Socket man-
ufacturers are Aries Electronics, Inc., Frenchtown, NJ; Garry
Manufacturing, New Brunswick, NJ; Robinson-Nugent, New
Albany, IN; and Samtec Electronic Hardward, New Albany, IN.
For further information refer to Appnote 22 in the current Sie-
mens Optoelectronic Data Book.
相关PDF资料
PDF描述
SCDV5541 5X5 DOT MATRIX DISPLAY, YELLOW, 3.2 mm
SCDV5543 5X5 DOT MATRIX DISPLAY, GREEN, 3.2 mm
SCF5249LAG120 32-BIT, 120 MHz, RISC PROCESSOR, PQFP144
SCF5250CAG120 32-BIT, 120 MHz, MICROPROCESSOR, PQFP144
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