参数资料
型号: SI4632DY-T1-GE3
厂商: Vishay Siliconix
文件页数: 2/10页
文件大小: 0K
描述: MOSFET N-CH 25V 8-SOIC
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 40A
开态Rds(最大)@ Id, Vgs @ 25° C: 2.7 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 2.6V @ 250µA
闸电荷(Qg) @ Vgs: 161nC @ 10V
输入电容 (Ciss) @ Vds: 11175pF @ 15V
功率 - 最大: 7.8W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
Si4632DY
Vishay Siliconix
SPECIFICATIONS (T J = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
V DS Temperature Coefficient
V GS(th) Temperature Coefficient
V DS
Δ V DS /T J
Δ V GS(th) /T J
V GS = 0 V, I D = 250 μA
I D = 250 μA
25
23
-6
V
mV/°C
Gate-Source Threshold Voltage
V GS(th)
V DS = V GS , I D = 250 μA
1.2
2.6
V
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current a
I GSS
I DSS
I D(on)
V DS = 0 V, V GS = ± 16 V
V DS = 25 V, V GS = 0 V
V DS = 25 V, V GS = 0 V, T J = 55 °C
V DS = ≥ 5 V, V GS = 10 V
30
± 100
1
10
nA
μA
A
Drain-Source On-State Resistance a
Forward Transconductance a
R DS(on)
g fs
V GS = 10 V, I D = 20 A
V GS = 4.5 V, I D = 15 A
V DS = 15 V, I D = 20 A
0.0022
0.0027
73
0.0027
0.0033
Ω
S
Dynamic b
Input Capacitance
C iss
3275
7450
11175
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
C oss
C rss
Q g
Q gs
V DS = 15 V, V GS = 0 V, f = 1 MHz
V DS = 15 V, V GS = 10 V, I D = 20 A
V DS = 15 V, V GS = 4.5 V, I D = 20 A
495
230
990
460
108
49
19
1485
690
161
73
pF
nC
Gate-Drain Charge
Q gd
11
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
R g
t d(on)
t r
t d(off)
t f
t d(on)
t r
t d(off)
t f
f = 1 MHz
V DD = 15 V, R L = 1.5 Ω
I D ? 10 A, V GEN = 4.5 V, R g = 1 Ω
V DD = 15 V, R L = 1.5 Ω
I D ? 10 A, V GEN = 10 V, R g = 1 Ω
1.3
42
115
55
14
20
69
58
8
2.0
65
175
85
23
30
105
90
15
Ω
ns
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
Pulse Diode Forward Current a
I S
I SM
T C = 25 °C
7
70
A
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
V SD
t rr
Q rr
t a
t b
I S = 3 A
I F = 13 A, dI/dt = 100 A/μs, T J = 25 °C
0.75
44
42
22
22
1.1
70
65
V
ns
nC
ns
Notes:
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 73786
S11-0209-Rev. C,14-Feb-11
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