参数资料
型号: SI5338P-A-GM
厂商: Silicon Laboratories Inc
文件页数: 33/44页
文件大小: 0K
描述: IC CLK GEN I2C BUS PROG 24QFN
标准包装: 490
系列: MultiSynth™
类型: *
PLL:
输入: CML,HCSL,HSCL,LVDS,LVPECL,晶体
输出: CMOS,HCSL. HSTL. LVDS. LVPECL. SSTL
电路数: 1
比率 - 输入:输出: 2:4
差分 - 输入:输出: 是/是
频率 - 最大: 350MHz
除法器/乘法器: 是/是
电源电压: 1.71 V ~ 3.63 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-VFQFN 裸露焊盘
供应商设备封装: 24-QFN(4x4)
包装: 托盘
Si5338
Rev. 1.3
39
10. Recommended PCB Land Pattern
Table 19. PCB Land Pattern
Dimension
Min
Nom
Max
P1
2.50
2.55
2.60
P2
2.50
2.55
2.60
X1
0.20
0.25
0.30
Y1
0.75
0.80
0.85
C1
3.90
C2
3.90
E0.50
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. Connect the center ground pad to a ground plane with no less than five vias. These 5 vias should have a length of no
more than 20 mils to the ground plane. Via drill size should be no smaller than 10 mils. A longer distance to the ground
plane is allowed if more vias are used to keep the inductance from increasing.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is
to be 60 m minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
9. A 2x2 array of 1.0 mm square openings on 1.25 mm pitch should be used for the center ground pad.
Card Assembly
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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