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| 型号： | SI7172DP-T1-GE3 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 1/9页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 200V 25A PPAK 8SOIC |
| 产品目录绘图： | DP-T1-(G)E3 Series 8-SOIC |
| 标准包装： | 1 |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 标准 |
| 漏极至源极电压(Vdss)： | 200V |
| 电流 - 连续漏极(Id) @ 25° C： | 25A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 70 毫欧 @ 5.9A，10V |
| Id 时的 Vgs(th)（最大）： | 4V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 77nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 2250pF @ 100V |
| 功率 - 最大： | 96W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | PowerPAK? SO-8 |
| 供应商设备封装： | PowerPAK? SO-8 |
| 包装： | 标准包装 |
| 产品目录页面： | 1663 (CN2011-ZH PDF) |
| 其它名称： | SI7172DP-T1-GE3DKR |
New Product
Si7172DP
Vishay Siliconix
N-Channel 200-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
200
R DS(on) ( Ω )
0.070 at V GS = 10 V
0.076 at V GS = 6 V
I D (A) g
25
24
Q g (Typ.)
34
?
?
?
?
Halogen-free
TrenchFET ? Power MOSFET
Low Thermal Resistance PowerPAK ? Package
100 % R g Tested
RoHS
COMPLIANT
PowerPAK SO-8
?
100 % UIS Tested
APPLICATIONS
6.15 mm
1
S
2
S
S
5.15 mm
? Primary Side Switch
? Industrial
D
D
3
4
G
8
D
7
6
D
5
D
G
Bottom View
Ordering Information: Si7172DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
200
± 20
25
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
20
5.9 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
4.8 b, c
30
30 a
4.5 b, c
15
11.25
A
mJ
T C = 25 °C
96
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
61.5
5.4 b, c
W
T A = 70 °C
3.5 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
R thJA
R thJC
18
1.0
23
1.5
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile ( http://www.vishay.com/ppg?73461 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 65 °C/W.
g. Based on T C = 25 °C.
Document Number: 68763
S-81730-Rev. A, 04-Aug-08
www.vishay.com
1
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