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| 型号： | SI7370DP-T1-GE3 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 1/8页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 60V 9.6A PPAK 8SOIC |
| 标准包装： | 3,000 |
| 系列： | TrenchFET® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 60V |
| 电流 - 连续漏极(Id) @ 25° C： | 9.6A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 11 毫欧 @ 12A，10V |
| Id 时的 Vgs(th)（最大）： | 4V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 57nC @ 10V |
| 功率 - 最大： | 1.9W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | PowerPAK? SO-8 |
| 供应商设备封装： | PowerPAK? SO-8 |
| 包装： | 带卷 (TR) |
Si7370DP
Vishay Siliconix
N-Channel 60-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
60
R DS(on) ( Ω )
0.011 at V GS = 10 V
0.013 at V GS = 6 V
I D (A)
15.8
14.5
? Halogen-free According to IEC 61249-2-21
Available
? TrenchFET ? Power MOSFET
? New Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
? PWM Optimized for Fast Switching
? 100 % R g Tested
APPLICATIONS
PowerPAK SO-8
? Primary Side Switch for 24 V DC/DC Applications
? Secondary Synchronous Rectifier
6.15 mm
1
S
2
S
S
5.15 mm
D
D
3
4
G
8
D
7
6
D
D
5
Bottom View
G
S
N-Channel MOSFET
Ordering Information: Si7370DP-T1-E3 (Lead (Pb)-free)
Si7370DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
60
± 20
Unit
V
Continuous Drain Current (T J = 150°C) a
T A = 25 °C
T A = 70 °C
I D
15.8
12.6
9.6
7.7
Continuous Source Current
Pulsed Drain Current
Avalanche Current
Single Avalanche Energy
I S
I DM
I AS
E AS
4.7
50
50
125
1.7
A
mJ
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b, c
T A = 25 °C
T A = 70 °C
P D
T J , T stg
5.2
3.3
- 55 to 150
260
1.9
1.25
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient a
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Steady State
R thJA
R thJC
19
52
1.5
24
65
1.8
°C/W
Notes
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71874
S09-0270-Rev. F, 16-Feb-09
www.vishay.com
1
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