参数资料
型号: SI7465DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH 60V 3.2A PPAK 8SOIC
产品目录绘图: DP-T1-(G)E3 Series 8-SOIC
标准包装: 1
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 3.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 64 毫欧 @ 5A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 40nC @ 10V
功率 - 最大: 1.5W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 标准包装
产品目录页面: 1665 (CN2011-ZH PDF)
其它名称: SI7465DP-T1-GE3DKR
Si7465DP
www.vishay.com
P-Channel 60 V (D-S) MOSFET
Vishay Siliconix
PRODUCT SUMMARY
V DS (V) R DS(on) ( ? )
0.064 at V GS = -10 V
-60
0.080 at V GS = -4.5 V
PowerPAK SO-8
I D (A)
-5
-4.5
Q g (TYP.)
26
FEATURES
? TrenchFET? Power MOSFET
? New Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
? Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
Availa b le
6.15 mm
1
S
S
5.15 mm
S
2
3
S
G
4
D
8
7
D
D
G
6
5
D
Bottom View
Ordering Information:
Si7465DP-T1-E3 (Lead (Pb)-free)
Si7465DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
D
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
V DS
V GS
10 s
STEADY STATE
-60
± 20
UNIT
V
Continuous Drain Current (T J = 150°C) a
Pulsed Drain Current
Continuous Source Current (Diode Conduction) a
Avalanche Current
Single Pulse Avalanche Energy
T A = 25 °C
T A = 70 °C
L = 0.1 mH
I D
I DM
I S
I AS
E AS
-5
-4
-2.9
-25
22
24.2
-3.2
-2.6
-1.2
A
mJ
Maximum Power Dissipation a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b,c
T A = 25 °C
T A = 70 °C
P D
T J , T stg
3.5
2.2
-55 to 150
260
1.5
0.94
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient a
Maximum Junction-to-Case (Drain)
t ? 10 s
Steady State
Steady State
R thJA
R thJC
27
60
3.3
36
85
4.3
°C/W
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. See solder profile ( www.vishay.com/ppg?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
c. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
S13-2263-Rev. D, 04-Nov-13
1
Document Number: 73113
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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