参数资料
型号: SI7629DN-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/13页
文件大小: 0K
描述: MOSFET P-CH 20V 1212-8 PPAK
标准包装: 1
系列: TrenchFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 35A
开态Rds(最大)@ Id, Vgs @ 25° C: 4.6 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 177nC @ 10V
输入电容 (Ciss) @ Vds: 5790pF @ 10V
功率 - 最大: 52W
安装类型: 表面贴装
封装/外壳: PowerPAK? 1212-8
供应商设备封装: PowerPAK? 1212-8
包装: 标准包装
其它名称: SI7629DN-T1-GE3DKR
New Product
Si7629DN
Vishay Siliconix
P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( ? )
0.0046 at V GS = - 10 V
- 20 0.0062 at V GS = - 4.5 V
0.0117 at V GS = - 2.5 V
I D (A)
- 35 a
- 35 a
- 35 a
Q g (Typ.)
59 nC
FEATURES
? TrenchFET ? Gen III P-Channel Power MOSFET
? 100 % R g and UIS Tested
? Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
PowerPAK? 1212-8
APPLICATIONS
? Adaptor Switch
S
3.3 mm
1
S
S
3.3 mm
? Battery Switch
2
S
? Load Switch
3
4
G
G
D
8
7
D
D
6
5
D
Bottom V ie w
Orderin g Information:
Si7629D N -T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
D
P-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
- 20
± 12
- 35 a
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
- 35 a
- 21.3 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Avalanche Current
Single Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
- 17.1 b, c
- 80
- 35 a
- 3.3 b, c
- 20
20
A
mJ
T C = 25 °C
52
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
33
3.7 b, c
W
T A = 70 °C
2.4 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t ? 10 s
Steady State
R thJA
R thJC
26
1.9
33
2.4
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile ( www.vishay.com/doc?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
Document Number: 70556
S12-0679-Rev. C, 26-Mar-12
For technical support, please contact: pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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