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| 型号： | SIJ800DP-T1-GE3 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 1/9页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 40V PPAK SO-8L |
| 标准包装： | 3,000 |
| 系列： | TrenchFET® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 40V |
| 电流 - 连续漏极(Id) @ 25° C： | 20A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 9.5 毫欧 @ 20A，10V |
| Id 时的 Vgs(th)（最大）： | 3V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 56nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 2400pF @ 20V |
| 功率 - 最大： | 35.7W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | PowerPAK? SO-8 |
| 供应商设备封装： | PowerPAK? SO-8 |
| 包装： | 带卷 (TR) |
SiJ800DP
Vishay Siliconix
N-Channel 40-V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( ? )
I D (A)
Q g (Typ.)
FEATURES
? Halogen-free According to IEC 61249-2-21
Definition
40
0.0095 at V GS = 10 V
0.0115 at V GS = 4.5 V
20 a
20 a
16 nC
? TrenchFET ? Power MOSFET
? 100 % R g Tested
? 100 % UIS Tested
PowerPAK ? SO-8L Single
? Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
5m
6.1
m
5 . 1 3
mm
?
?
Backlight Inverter
High-Side Switch
D
?
Server, VRM, POL
D
?
DC/DC
4
G
S
3
S
2
S
1
G
S
Ordering Information: SiJ800DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
N -Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
40
± 20
20 a
Unit
V
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Avalanche Current
Avalanche Energy
Continuous Source-Drain Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
L = 0.1 mH
T C = 25 °C
T A = 25 °C
I D
I DM
I AS
E AS
I S
20 a
15.6 b, c
12.5 b, c
80
30
45
20 a
3.5 b, c
A
mJ
A
T C = 25 °C
35.7
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
22.9
4.2 b, c
W
T A = 70 °C
2.7 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t ? 10 s
Steady State
R thJA
R thJC
25
2.9
30
3.5
°C/W
Notes:
a. Based on T C = 25 °C. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile ( www.vishay.com/doc?73257 ). The PowerPAK SO-8L. The end of the lead terminal is exposed copper (not plated) as a
result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 70 °C/W.
Document Number: 64803
S09-0668-Rev. A, 20-Apr-09
www.vishay.com
1
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