参数资料
型号: SIR464DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 30V 50A PPAK 8SOIC
产品目录绘图: DP-T1-(G)E3 Series 8-SOIC
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 50A
开态Rds(最大)@ Id, Vgs @ 25° C: 3.1 毫欧 @ 15A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 95nC @ 10V
输入电容 (Ciss) @ Vds: 3545pF @ 15V
功率 - 最大: 69W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 标准包装
产品目录页面: 1662 (CN2011-ZH PDF)
其它名称: SIR464DP-T1-GE3DKR
New Product
SiR464DP
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
30
R DS(on) ( Ω )
0.0031 at V GS = 10 V
0.0038 at V GS = 4.5 V
I D (A) a, e
50
50
Q g (Typ.)
26.5 nC
? Halogen-free
? TrenchFET ? Power MOSFET
? 100 % R g and UIS Tested
RoHS
COMPLIANT
PowerPAK SO-8
APPLICATIONS
? DC/DC Conversion
- Low-Side Switch
6.15 mm
1
S
2
S
S
5.15 mm
? Notebook
? Server
D
D
3
4
G
8
7
D
6
D
5
D
G
Bottom V ie w
Orderin g Information: SiR464DP-T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N -Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
30
± 20
50 e
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
50 e
29.5 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
23.5 b, c
70
50 e
4.7 b, c
40
80
A
mJ
T C = 25 °C
69
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
44.4
5.2 b, c
W
T A = 70 °C
3.3 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) f, g
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Typical Maximum Unit
Maximum Junction-to-Ambient b, d t ≤ 10 s
Maximum Junction-to-Case (Drain) Steady State
R thJA
R thJC
19 24
1.2 1.8
°C/W
Notes:
a. Based on T C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 65 °C/W.
e. Package limited.
f. See Solder Profile ( http://www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
g. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 68871
S-82017-Rev. A, 01-Sep-08
www.vishay.com
1
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