参数资料
型号: SIR470DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 40V 60A PPAK 8SOIC
产品目录绘图: DP-T1-(G)E3 Series 8-SOIC
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 40V
电流 - 连续漏极(Id) @ 25° C: 60A
开态Rds(最大)@ Id, Vgs @ 25° C: 2.3 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 155nC @ 10V
输入电容 (Ciss) @ Vds: 5660pF @ 20V
功率 - 最大: 104W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 标准包装
产品目录页面: 1663 (CN2011-ZH PDF)
其它名称: SIR470DP-T1-GE3DKR
New Product
SiR470DP
Vishay Siliconix
N-Channel 40-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
40
R DS(on) ( Ω )
0.0023 at V GS = 10 V
0.00265 at V GS = 4.5 V
I D (A) a
60
60
Q g (Typ.)
45.5 nC
?
?
?
?
Halogen-free
TrenchFET ? Gen III Power MOSFET
100 % R g Tested
100 % UIS Tested
RoHS
COMPLIANT
PowerPAK ? SO-8
APPLICATIONS
? Secondary Side Synchronous Rectification
? Power Supply
6.15 mm
1
S
S
5.15 mm
D
2
3
S
G
4
D
8
D
7
6
D
5
D
G
Bottom View
Ordering Information: SiR470DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
40
± 20
60 a
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
60 a
38.8 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
31 b, c
100
60 a
5.6 b, c
50
125
A
mJ
T C = 25 °C
104
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
66.6
6.25 b, c
W
T A = 70 °C
4.0 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
R thJA
R thJC
15
0.9
20
1.2
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile ( http://www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 54 °C/W.
Document Number: 68899
S-82295-Rev. A, 22-Sep-08
www.vishay.com
1
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