参数资料
型号: SMMBD770T1G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 127K
描述: DIODE SCHOTTKY 200MA 70V SOT-323
标准包装: 3,000
二极管类型: 肖特基
电压 - (Vr)(最大): 70V
电流 - 平均整流 (Io): 200mA(DC)
电压 - 在 If 时为正向 (Vf)(最大): 1V @ 10mA
速度: *
电流 - 在 Vr 时反向漏电: 200nA @ 35V
电容@ Vr, F: 1pF @ 20V,1MHz
安装类型: 表面贴装
封装/外壳: SC-70,SOT-323
供应商设备封装: SC-70-3(SOT323)
包装: 带卷 (TR)
?
Semiconductor Components Industries, LLC, 2011
November, 2011 ?
Rev. 6
1
Publication Order Number:
MMBD330T1/D
MMBD330T1G,
SMMBD330T1G,
MMBD770T1G,
SMMBD770T1G
Schottky Barrier Diodes
Schottky barrier diodes are designed primarily for high?efficiency
UHF and VHF detector applications. Readily available to many other
fast switching RF and digital applications. They are housed in the
SOT?323/SC?70 package which is designed for low?power surface
mount applications.
Features
?
Extremely Low Minority Carrier Lifetime
?
Very Low Capacitance
?
Low Reverse Leakage
?
Available in 8 mm Tape and Reel
?
AEC Qualified and PPAP Capable
?
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
?
These Devices are Pb?Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
MMBD330T1G, SMMBD330T1G
MMBD770T1G, SMMBD770T1G
VR
30
70
Vdc
Forward Continuous Current (DC)
IF
200
mA
Nonrepetitive Peak Forward Current
(Note 1)
IFSM
1.0
A
Forward Power Dissipation
TA
= 25
?C
PF
120
mW
Junction Temperature
TJ
?55 to +125
?C
Storage Temperature Range
Tstg
?55 to +150
?C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. 60 Hz Halfsine.
*For additional information on our Pb?Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
*Date Code orientation may vary depending
upon the manufacturing location.
http://onsemi.com
Device Package Shipping?
ORDERING INFORMATION
MARKING DIAGRAMS
SC?70/SOT?323
CASE 419
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MMBD770T1G SC?70
(Pb?Free)
3,000/Tape & Reel
13
MMBD330T1G SC?70
(Pb?Free)
3,000/Tape & Reel
XX M
1
XX = Specific Device Code
4T = MMBD330T1
5H = MMBD770T1
M = Date Code
= Pb?Free Package
(Note: Microdot may be in either location)
SMMBD330T1G SC?70
(Pb?Free)
3,000/Tape & Reel
SMMBD770T1G SC?70
(Pb?Free)
3,000/Tape & Reel
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