参数资料
型号: SMP18FS-REEL
厂商: Analog Devices Inc
文件页数: 3/8页
文件大小: 0K
描述: IC AMP SAMPLE HOLD OCTAL 16SOIC
标准包装: 2,500
放大器类型: 采样和保持
电路数: 8
转换速率: 7 V/µs
电流 - 输入偏压: 500nA
电压 - 输入偏移: 2500µV
电流 - 电源: 6mA
电流 - 输出 / 通道: 1.2mA
电压 - 电源,单路/双路(±): 5 V ~ 12 V,±2.5 V ~ 6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC
包装: 带卷 (TR)
SMP18
REV. C
–3–
PIN CONNECTIONS
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
SMP18
CH4OUT
CH0OUT
CH1OUT
CH2OUT
VDD
CH6OUT
INPUT
CH7OUT
B CONTROL
A CONTROL
CH3OUT
CH5OUT
INH
VSS
DGND
C CONTROL
ORDERING GUIDE
Temperature
Package
Model
Range
Description
Option
SMP18FP
–40
°C to +85°C
Plastic DIP
N-16
SMP18FRU
–40
°C to +85°C
TSSOP-16
RU-16
SMP18FS
–40
°C to +85°C
SO-16
R-16A
ABSOLUTE MAXIMUM RATINGS
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
VOUT to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . .
±20 mA
(Not short-circuit protected)
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Package Type
JA*
JC
Units
16-Pin Plastic DIP (P)
76
33
°C/W
16-Pin SOIC (S)
92
27
°C/W
16-Lead TSSOP (RU)
180
35
°C/W
NOTES
*
θ
JA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for plastic DIP packages;
θ
JA is specified for device soldered to printed
circuit board for SOIC and TSSOP packages.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SMP18 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
相关PDF资料
PDF描述
69192-164HLF BERGSTIK II DR STRAIGHT RET
AD842KNZ IC OPAMP GP 80MHZ 100MA 14DIP
DF7-6P-3.96DS CONN HEADER 6POS 3.96MM RT ANG T
TSM-108-01-TM-DV-P CONN HEADER 16POS .100" DBL SMD
OP467GS-REEL IC OPAMP GP 28MHZ QUAD 16SOIC
相关代理商/技术参数
参数描述
SMP18FSZ 功能描述:IC AMP SAMPLE HOLD OCTAL 16SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:1 系列:- 放大器类型:通用 电路数:4 输出类型:满摆幅 转换速率:0.028 V/µs 增益带宽积:105kHz -3db带宽:- 电流 - 输入偏压:3nA 电压 - 输入偏移:100µV 电流 - 电源:3.3µA 电流 - 输出 / 通道:12mA 电压 - 电源,单路/双路(±):2.7 V ~ 12 V,±1.35 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:剪切带 (CT) 其它名称:OP481GRUZ-REELCT
SMP18FSZ-REEL 功能描述:IC AMP SAMPLE HOLD OCTAL 16SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:Excalibur™ 放大器类型:J-FET 电路数:1 输出类型:- 转换速率:45 V/µs 增益带宽积:10MHz -3db带宽:- 电流 - 输入偏压:20pA 电压 - 输入偏移:490µV 电流 - 电源:1.7mA 电流 - 输出 / 通道:48mA 电压 - 电源,单路/双路(±):4.5 V ~ 38 V,±2.25 V ~ 19 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
SMP18-M3/84A 功能描述:ESD 抑制器 400watt 18volt 10% Unidir RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
SMP18-M3/85A 功能描述:ESD 抑制器 400watt 18volt 10% Unidir RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
SMP-18V-BC 制造商:JST Manufacturing 功能描述: 制造商:JST Manufacturing 功能描述:Conn Housing PL 18 POS Crimp ST Bag 制造商:JST Manufacturing 功能描述:Connector,Plastic Housing Lance,Multipo