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参数资料
| 型号： | SPC560B50L5C5E0R |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP144 |
| 封装： | 20 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-144 |
| 文件页数： | 24/74页 |
| 文件大小： | 971K |
| 代理商： | SPC560B50L5C5E0R |
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SPC560Bx, SPC560Cx
Electrical characteristics
Doc ID 14619 Rev 4
4.9
Power management electrical characteristics
4.9.1
Voltage regulator electrical characteristics
The device implements an internal voltage regulator to generate the low voltage core supply
VDD_LV from the high voltage ballast supply VDD_BV. The regulator itself is supplied by the
common I/O supply VDD. The following supplies are involved:
●
HV—High voltage external power supply for voltage regulator module. This must be
provided externally through VDD power pin.
●
BV—High voltage external power supply for internal ballast module. This must be
provided externally through VDD_BV power pin. Voltage values should be aligned with
VDD.
●
LV—Low voltage internal power supply for core, FMPLL and flash digital logic. This is
generated by the internal voltage regulator but provided outside to connect stability
capacitor. It is further split into four main domains to ensure noise isolation between
critical LV modules within the device:
–
LV_COR—Low voltage supply for the core. It is also used to provide supply for
FMPLL through double bonding.
–
LV_CFLA—Low voltage supply for code flash module. It is supplied with dedicated
ballast and shorted to LV_COR through double bonding.
–
LV_DFLA—Low voltage supply for data flash module. It is supplied with dedicated
ballast and shorted to LV_COR through double bonding.
–
LV_PLL—Low voltage supply for FMPLL. It is shorted to LV_COR through double
bonding.
1.
VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified
2.
All values need to be confirmed during device validation.
3.
This is a transient configuration during power-up, up to the end of reset PHASE2 (refer to RGM module section of the
device reference manual).
4.
CL includes device and package capacitance (CPKG <5 pF).
5.
The configuration PAD3V5 = 1 when VDD = 5 V is only transient configuration during power-up. All pads but RESET and
Nexus output (MDOx, EVTO, MCKO) are configured in input or in high impedance state.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SPC560B50L5C6E0X | 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC560B50L5C6E0Y | 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC560B50SK | 功能描述:开发板和工具包 - ARM Raisonance Kit 512K Starter Rflasher 64 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V |
| SPC560B60L3C6E0X | 制造商:STMicroelectronics 功能描述:MID MICROCONTROLLER - Tape and Reel 制造商:STMicroelectronics 功能描述:IC MCU 32BIT 1MB FLASH 100LQFP |
| SPC560B60L5C6E0X | 制造商:STMicroelectronics 功能描述:IC MCU 32BIT 1MB FLASH 144LQFP |
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