- 您现在的位置：买卖IC网 > PDF目录2017 > SPC5634MF1MLQ80 (Freescale Semiconductor)IC MCU FLASH 1.5M 94K 144-LQFP PDF资料下载
参数资料
| 型号： | SPC5634MF1MLQ80 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 80/122页 |
| 文件大小： | 0K |
| 描述： | IC MCU FLASH 1.5M 94K 144-LQFP |
| 标准包装： | 60 |
| 系列： | MPC56xx Qorivva |
| 核心处理器： | e200z3 |
| 芯体尺寸： | 32-位 |
| 速度： | 80MHz |
| 连通性： | CAN，EBI/EMI，LIN，SCI，SPI，UART/USART |
| 外围设备： | DMA，POR，PWM，WDT |
| 输入/输出数： | 114 |
| 程序存储器容量： | 1.5MB（1.5M x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 94K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 4.5 V ~ 5.25 V |
| 数据转换器： | A/D 32x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | 144-LQFP |
| 包装： | 托盘 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页当前第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页
MPC5634M Microcontroller Data Sheet, Rev. 9
Electrical characteristics
Freescale Semiconductor
60
4.3.1
General notes for specifications at maximum junction temperature
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA * PD)
Eqn. 1
where:
TA = ambient temperature for the package (oC)
RJA = junction-to-ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a
four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance
is not a constant. The thermal resistance depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly packed printed circuit
board. The value obtained on a board with the internal planes is usually within the normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding components. In addition, the
ambient temperature varies widely within the application. For many natural convection and especially closed box applications,
the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the
device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB * PD)
Eqn. 2
where:
TB = board temperature for the package perimeter (oC)
RJB = junction-to-board thermal resistance (oC/W) per JESD51-8S
PD = power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value for the junction
temperature is predictable. Ensure the application board is similar to the thermal test condition, with the component soldered to
a board with internal planes.
7 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
相关PDF资料 |
PDF描述 |
|---|---|
| SPL505YC256BT | IC CLOCK CK505 BEARLAKE 56TSSOP |
| SPL505YC264BT | IC CLOCK CK505 BEARLAKE 64TSSOP |
| SSM2603CPZ-R2 | IC CODEC AUDIO LOW POWER 28LFCSP |
| SSM2604CPZ-REEL | IC AUDIO CODEC LP 20-LFCSP |
| SY100E195JY TR | IC DELAY LINE 128TAP 28-PLCC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SPC5634MF1MLU60 | 功能描述:32位微控制器 - MCU 1.5M FLASH 94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5634MF1MLU80 | 功能描述:32位微控制器 - MCU 1.5M FLASH 94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5634MF1MMG60 | 功能描述:32位微控制器 - MCU 1.5M FLASH 94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5634MF1MMG80 | 功能描述:32位微控制器 - MCU 1.5M Flash,94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5634MF2MLQ80 | 制造商:Freescale Semiconductor 功能描述:SPC5634MF2MLQ80 - Bulk |
发布紧急采购，3分钟左右您将得到回复。