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| 型号： | SSM2301CPZ-REEL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 4/16页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO 1.52W MONO D 8LFCSP |
| 标准包装： | 5,000 |
| 类型： | D 类 |
| 输出类型： | 1-通道（单声道） |
| 在某负载时最大输出功率 x 通道数量： | 1.52W x 1 @ 8 欧姆 |
| 电源电压： | 2.5 V ~ 5 V |
| 特点： | 消除爆音，差分输入，短路和热保护，关闭 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 8-LFCSP-VD（3x3） |
| 封装/外壳： | 8-VFDFN 裸露焊盘，CSP |
| 包装： | 带卷 (TR) |
| 配用： | SSM2301-MINI-EVALZ-ND - BOARD EVAL MINI SSM2301 |
SSM2301
Rev. A | Page 12 of 16
APPLICATIONS INFORMATION
OVERVIEW
The SSM2301 mono Class-D audio amplifier features a filterless
modulation scheme that greatly reduces external component count,
conserving board space and, thus, reducing system cost. The
SSM2301 does not require an output filter but, instead, relies
on the inherent inductance of the speaker coil and the natural
filtering of the speaker and human ear to fully recover the audio
component of the square-wave output. While most Class-D ampli-
fiers use some variation of pulse-width modulation (PWM), the
SSM2301 uses a Σ-Δ modulation to determine the switching
pattern of the output devices. This provides a number of important
benefits. Σ-Δ modulators do not produce a sharp peak with many
harmonics in the AM frequency band, as pulse-width modulators
often do. Σ-Δ modulation reduces the amplitude of spectral
components at high frequencies, thereby reducing EMI emission
that might otherwise be radiated by speakers and long cable traces.
The SSM2301 also offers protection circuitry for output short-
circuit and high temperature conditions. When the fault-inducing
condition is removed, the SSM2301 automatically recovers
without the need for a hard reset.
GAIN SELECTION
Pulling the GAIN pin of the SSM2301 high sets the gain of the
speaker amplifier to 12 dB; pulling it low sets the gain of the
speaker amplifier to 6 dB.
It is possible to adjust the SSM2301 gain by using external resistors
at the input. To set a gain lower than 12 dB, see Figure 26 for
differential input configuration and Figure 27 for single-ended
configuration. For external gain configuration from a fixed 12 dB
gain, use the following formula:
External Gain Settings = 20 log[4/(1 + R/150 kΩ)]
To set a gain lower than 6 dB, see Figure 28 for differential input
configuration and Figure 29 for single-ended configuration. For
external gain configuration from a fixed 6 dB gain, use the
following formula:
External Gain Settings = 20 log[2/(1 + R/150 kΩ)]
POP-AND-CLICK SUPPRESSION
Voltage transients at the output of audio amplifiers may occur
when shutdown is activated or deactivated. Voltage transients
as low as 10 mV can be heard as an audio pop in the speaker.
Clicks and pops can also be classified as undesirable audible
transients generated by the amplifier system and, therefore,
as not coming from the system input signal. Such transients may
be generated when the amplifier system changes its operating
mode. For example, the following can be sources of audible
transients: system power-up/power-down, mute/unmute, input
source change, and sample rate change. The SSM2301 has a pop-
and-click suppression architecture that reduces these output
transients, resulting in noiseless activation and deactivation.
LAYOUT
As output power continues to increase, care must be taken to
lay out PCB traces and wires properly between the amplifier,
load, and power supply. A good practice is to use short, wide
PCB tracks to decrease voltage drops and minimize inductance.
Make track widths at least 200 mil for every inch of track length
for lowest DCR, and use 1 oz or 2 oz of copper PCB traces to
further reduce IR drops and inductance.
Poor layout increases voltage drops, consequently affecting
efficiency. Use large traces for the power supply inputs and
amplifier outputs to minimize losses due to parasitic trace
resistance. Proper grounding guidelines help improve audio
performance, minimize crosstalk between channels, and prevent
switching noise from coupling into the audio signal. To maintain
high output swing and high peak output power, PCB traces that
connect the output pins to the load and supply pins should be
as wide as possible to maintain the minimum trace resistances.
It is also recommended that a large-area ground plane be used for
minimum impedances. Good PCB layouts also isolate critical
analog paths from sources of high interference. High frequency
circuits (analog and digital) should be separated from low
frequency circuits. Properly designed multilayer printed circuit
boards can reduce EMI emission and increase immunity to the
RF field by a factor of 10 or more compared with double-sided
boards. A multilayer board allows a complete layer to be used
for the ground plane, whereas the ground plane side of a double-
side board is often disrupted with signal crossover. If the system
has separate analog and digital ground and power planes, the
analog ground plane should be underneath the analog power plane,
and, similarly, the digital ground plane should be underneath the
digital power plane. There should be no overlap between analog
and digital ground planes or analog and digital power planes.
INPUT CAPACITOR SELECTION
The SSM2301 does not require input coupling capacitors if the
input signal is biased from 1.0 V to VDD 1.0 V. Input capacitors
are required if the input signal is not biased within this recom-
mended input dc common-mode voltage range, if high-pass
filtering is needed (see Figure 24) or if using a single-ended
source (see Figure 25). If high-pass filtering is needed at the input,
the input capacitor, along with the input resistor of the SSM2301,
forms a high-pass filter whose corner frequency is determined
by the following equation:
fC = 1/(2π × RIN × CIN)
The input capacitor can have very important effects on the
circuit performance. Not using input capacitors degrades the
output offset of the amplifier as well as the PSRR performance.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SSM2301CPZ-REEL7 | 功能描述:IC AMP AUDIO 1.52W MONO D 8LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 标准包装:1 系列:- 类型:AB 类 输出类型:耳机，2-通道（立体声） 在某负载时最大输出功率 x 通道数量:30mW x 2 @ 32 欧姆 电源电压:2.7 V ~ 5.5 V 特点:3D，低音提升，无噪音，热保护，关断 安装类型:表面贴装 供应商设备封装:20-QFN（3x3） 封装/外壳:20-WFQFN 裸露焊盘 包装:Digi-Reel® 其它名称:706-1163-6 |
| SSM2301-EVALZ | 制造商:Analog Devices 功能描述:Evaluation Board For Filterless Class-D Audio Amplifier 制造商:Analog Devices 功能描述:EVAL BD - Bulk 制造商:Analog Devices 功能描述:Class-D Audio Amplifier Eval. Board |
| SSM2301-MINI-EVALZ | 功能描述:BOARD EVAL MINI SSM2301 RoHS:是 类别:编程器，开发系统 >> 评估板 - 音频放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
| SSM2301-MINI-EVALZ | 制造商:Analog Devices 功能描述:Class-D Audio Amplifier Eval. Board |
| SSM2301N | 制造商:未知厂家 制造商全称:未知厂家 功能描述:P-CHANNEL ENHANCEMENT-MODE POWER MOSFET |
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