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| 型号： | SSM2319CBZ-R2 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 7/20页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO 3.7W MONO D 9WLCSP |
| 标准包装： | 1 |
| 类型： | D 类 |
| 输出类型： | 1-通道（单声道） |
| 在某负载时最大输出功率 x 通道数量： | 3.7W x 1 @ 3 欧姆 |
| 电源电压： | 2.5 V ~ 5.5 V |
| 特点： | 消除爆音，差分输入，短路和热保护，关闭 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 9-WLCSP（1.52 x 1.69） |
| 封装/外壳： | 9-UFBGA，WLCSP |
| 包装： | 标准包装 |
| 其它名称： | SSM2319CBZ-R2DKR |
SSM2319
Rev. 0 | Page 15 of 20
LAYOUT
As output power continues to increase, care must be taken to
lay out PCB traces and wires properly between the amplifier,
load, and power supply. A good practice is to use short, wide
PCB tracks to decrease voltage drops and minimize inductance.
Ensure that track widths are at least 200 mil for every inch of
track length for lowest DCR and use 1 oz or 2 oz of copper PCB
traces to further reduce IR drops and inductance. A poor layout
increases voltage drops, consequently affecting efficiency. Use
large traces for the power supply inputs and amplifier outputs
to minimize losses due to parasitic trace resistance.
Proper grounding guidelines help to improve audio performance,
minimize crosstalk between channels, and prevent switching noise
from coupling into the audio signal. To maintain high output swing
and high peak output power, the PCB traces that connect the
output pins to the load and to the supply pins should be as wide
as possible to maintain the minimum trace resistances. It is also
recommended that a large ground plane be used for minimum
impedances.
In addition, good PCB layouts isolate critical analog paths from
sources of high interference. High frequency circuits (analog
and digital) should be separated from low frequency circuits.
Properly designed multilayer PCBs can reduce EMI emissions
and increase immunity to the RF field by a factor of 10 or more
when compared with double-sided boards. A multilayer board
allows a complete layer to be used for the ground plane, whereas
the ground plane side of a double-sided board is often disrupted
by signal crossover.
If the system has separate analog and digital ground and power
planes, the analog ground plane should be underneath the analog
power plane, and, similarly, the digital ground plane should be
underneath the digital power plane. There should be no overlap
between analog and digital ground planes or analog and digital
power planes.
INPUT CAPACITOR SELECTION
The SSM2319 does not require input coupling capacitors if the
input signal is biased from 1.0 V to VDD 1.0 V. Input capacitors
are required if the input signal is not biased within this recom-
mended input dc common-mode voltage range, if high-pass
filtering is needed, or if using a single-ended source. If high-
pass filtering is needed at the input, the input capacitor, along
with the input resistor of the SSM2319, form a high-pass filter
whose corner frequency is determined by
fC = 1/{2π × (40 kΩ + REXT) × CIN}
The input capacitor can significantly affect the performance of
the circuit. Not using input capacitors degrades both the output
offset of the amplifier and the PSRR performance.
POWER SUPPLY DECOUPLING
To ensure high efficiency, low THD, and high PSRR, proper
power supply decoupling is necessary. Noise transients on the
power supply lines are short-duration voltage spikes. Although
the actual switching frequency can range from 10 kHz to 100 kHz,
these spikes can contain frequency components that extend into
the hundreds of megahertz. The power supply input needs to be
decoupled with a good quality, low ESL, low ESR capacitor, usually
of around 4.7 μF. This capacitor bypasses low frequency noises
to the ground plane. For high frequency transients noises, use a
0.1 μF capacitor as close as possible to the VDD pin of the device.
Placing the decoupling capacitor as close as possible to the
SSM2319 helps to maintain efficient performance.
SYNCRONIZATION (SYNC) OPERATION
SYNC is the feature that allows an external clock signal to control
the modulator of the SSM2319. The SSM2319 can act in standalone
mode, act as a master device, or act as a slave device. Although
the inherent random switching frequency of the Analog Devices
patented 3-level PDM modulation virtually eliminates the need for
SYNC, this feature can be activated in the event that end users are
concerned about clock intermodulation (beating effect) of several
amplifiers in close proximity.
Another use for the SYNC feature is its ability to adjust modulator
frequency to move harmonic interference to a less sensitive
frequency band in certain applications with very delicate
interference requirements.
Although the synchronization frequency operates from 5 MHz to
12 MHz, the optimal operating range is 6 MHz to 9 MHz.
Modulator synchronization is initiated after the internal shut-
down signal is released. SYNCO buffers the internal oscillator
clock with a delay of 127 clock cycles.
When synchronizing several SSM2319 amplifiers, configure
them in a daisy-chain configuration, as shown in Figure 35.
Using this configuration causes a small delay in the SYNCO-to-
SYNCO transitions of multiple SSM2319s, preventing large
surges of instantaneous current and reducing excessive loading
of the power supply.
When configuring one device to act as a master device, it is
mandatory that the connection from SYNCO to SYCNI be less
than 1 mm. As in many digital systems, to maintain signal integrity
when interfacing several clocking systems, users must insert series
dumping resistors close to the SYNCO pin if long trace lengths
are used for synchronization connections. A typical value used
is 750 Ω. The series dumping resistor should be placed as close
to the SYNCO pin as possible. If careful layout practices are
followed to minimize signal trace routing from the SYNCO pin
of one device to the SYNCI pin of another, a dumping resistor is
not necessary. If the SYNC feature is not used, or if the SYNC
feature is not interfacing the SYNCO pin to an external device,
it is recommended that the SYNCO pin be floated.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SSM2319CBZ-REEL | 功能描述:IC AMP AUDIO 3.7W MONO D 9WLCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:D 类 输出类型:1-通道（单声道），带立体声耳机 在某负载时最大输出功率 x 通道数量:930mW x 1 @ 8 欧姆; 40mW x 2 @ 16 欧姆 电源电压:2.7 V ~ 5.5 V 特点:消除爆音，差分输入，I²C，静音，关闭，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) 其它名称:MAX97000EWA+T-ND |
| SSM2319CBZ-REEL7 | 功能描述:IC AMP AUDIO 3W MONO D 9WLCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 标准包装:2,000 系列:- 类型:AB 类 输出类型:2 通道（立体声） 在某负载时最大输出功率 x 通道数量:- 电源电压:4 V ~ 18 V 特点:- 安装类型:通孔 供应商设备封装:8-DIP 封装/外壳:8-DIP（0.300"，7.62mm） 包装:管件 |
| SSM2335 | 制造商:AD 制造商全称:Analog Devices 功能描述:Filterless, High Efficiency, Mono 3 W Class-D Audio Amplifier |
| SSM2335CBZ-R2 | 功能描述:IC AMP AUDIO 4.28W MONO D 9WLCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机，2-通道（立体声） 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C，麦克风，静音，短路保护，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) |
| SSM2335CBZ-REEL | 功能描述:IC AMP AUDIO 4.28W MONO D 9WLCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 标准包装:2,000 系列:- 类型:AB 类 输出类型:2 通道（立体声） 在某负载时最大输出功率 x 通道数量:- 电源电压:4 V ~ 18 V 特点:- 安装类型:通孔 供应商设备封装:8-DIP 封装/外壳:8-DIP（0.300"，7.62mm） 包装:管件 |
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