参数资料
型号: STM8AF6126TBY
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 8-BIT, FLASH, 16 MHz, MICROCONTROLLER, PQFP32
封装: 7 X 7 MM, ROHS COMPLIANT, LQFP-32
文件页数: 80/99页
文件大小: 881K
代理商: STM8AF6126TBY
STM8AF61xx, STM8AF62xx
Electrical characteristics
Doc ID 14952 Rev 4
10.4
Thermal characteristics
In case the maximum chip junction temperature (TJmax) specified in Table 37: General
is exceeded, the functionality of the device cannot be
guaranteed.
TJmax, in degrees Celsius, may be calculated using the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
–TAmax is the maximum ambient temperature in °C
ΘJA is the package junction-to-ambient thermal resistance in ° C/W
–PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
–PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum
chip internal power.
–PI/Omax represents the maximum power dissipation on output pins
Where:
PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH),
taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level
in the application.
10.4.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Table 62.
Thermal characteristics(1)
1.
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
57
°C/W
ΘJA
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
59
°C/W
ΘJA
Thermal resistance junction-ambient
VFQFPN32
25
°C/W
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