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| 型号： | TC1266VUATR |
| 厂商： | Microchip Technology |
| 文件页数： | 5/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V 200MA PCI 8MSOP |
| 标准包装： | 2,500 |
| 应用： | 转换器，PCI 外围设备卡应用 |
| 输入电压： | 4.3 V ~ 5.5 V |
| 输出数： | 1 |
| 输出电压： | 3.3V |
| 工作温度： | -5°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 带卷 (TR) |
TC1266
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
Integrated thermal protection circuitry shuts the
Given:
regulator off when die temperature exceeds 160°C.
V IN MAX
= 5V ± 5%
The regulator remains off until the die temperature
drops to approximately 150°C.
V OUT MIN = 3.217V
I LOAD MAX = 200mA
4.2
Power Dissipation
T J MAX
= 125°C
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
T A MAX
θ JA
= 70°C
= 130°C/W (SOIC)
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
P D ≈ (V IN MAX – V OUT MIN )I LOAD MAX
Where:
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P D ≈ (V IN MAX – V OUT MIN )I LOAD MAX
= (5.25V - 3.217V) 200mA
= 407mW
P D =
V IN MAX =
V OUT MIN =
I LOAD MAX =
Worst case actual power dissipation
Maximum voltage on V IN
Minimum regulator output voltage
Maximum output (load) current
Maximum allowable power dissipation:
P D MAX = (T J MAX – T A MAX )
θ JA
= (125 – 70 )
The maximum allowable power dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (T A MAX ), the maximum allowable die
temperature (T J MAX ) and the thermal resistance from
junction-to-air ( θ JA ).
EQUATION 4-2:
P D MAX = ( T J MAX – T A MAX )
θ JA
Where all terms are previously defined.
2002 Microchip Technology Inc.
130
= 423mW
In this example, the TC1266 dissipates a maximum of
407mW; below the allowable limit of 423mW.
DS21377B-page 5
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