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参数资料
| 型号： | TC530COI713 |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO28 |
| 封装： | SOIC-28 |
| 文件页数： | 10/28页 |
| 文件大小： | 568K |
| 代理商： | TC530COI713 |
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TC530/TC534
DS21433C-page 18
2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (PJ) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
.100 BSC
Top to Seating Plane
A
–
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
–
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.050
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
.430
NOTE 1
N
12
D
E1
eB
c
E
L
A2
e
b
b1
A1
A
3
Microchip Technology Drawing C04-070B
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| TC530CPJ | 功能描述:数据转换系统 Prec Data Acq Subsys RoHS:否 制造商:Texas Instruments 转换速率:0.001 MSPs 分辨率:24 bit 最大工作温度:+ 125 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TC531000AP-F711 | 制造商:Toshiba America Electronic Components 功能描述:531000AP-F711 |
| TC531001 | 制造商:TOSHIBA 制造商全称:Toshiba Semiconductor 功能描述:1M BIT (128K WORD x 8 BIT) CMOS MASK ROM |
| TC531001CF | 制造商:Toshiba America Electronic Components 功能描述: |
| TC531001CF-12 | 制造商:TOSHIBA 制造商全称:Toshiba Semiconductor 功能描述:1M BIT (128K WORD x 8 BIT) CMOS MASK ROM |
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