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参数资料
| 型号： | TC530COI713 |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO28 |
| 封装： | SOIC-28 |
| 文件页数： | 13/28页 |
| 文件大小： | 568K |
| 代理商： | TC530COI713 |
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TC530/TC534
DS21433C-page 20
2007 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (PL) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
40
Pitch
e
.100 BSC
Top to Seating Plane
A
–
.250
Molded Package Thickness
A2
.125
–
.195
Base to Seating Plane
A1
.015
–
Shoulder to Shoulder Width
E
.590
–
.625
Molded Package Width
E1
.485
–
.580
Overall Length
D
1.980
–
2.095
Tip to Seating Plane
L
.115
–
.200
Lead Thickness
c
.008
–
.015
Upper Lead Width
b1
.030
–
.070
Lower Lead Width
b
.014
–
.023
Overall Row Spacing §
eB
–
.700
N
NOTE 1
E1
D
12 3
A
A1
b1
b
e
c
eB
E
L
A2
Microchip Technology Drawing C04-016B
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