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参数资料
| 型号： | TDA1308TD-G |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 0.06 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
| 封装： | PLASTIC, SO-8 |
| 文件页数： | 16/26页 |
| 文件大小： | 197K |
| 代理商： | TDA1308TD-G |
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IX. PRODUCT IDENTIFICATION
LINEAR AND RF PRODUCTS
Example:
NE
XXXX
N
Package Code:
A = Plastic Leaded Chip Carriers (PLCC)
D = Plastic SO
DK = Shrink Small Outline (SSOP)
F = Ceramic Dual In-Line
FE = Hermetic Cerdip (8 Lead)
N = Plastic Dual In-Line
Device Number
Device Family and Temperature Range Prefix:
AU = -40°C to +125°C
NE = 0°C to +70°C
SE = -55°C to +125°C
SA = -40°C to +85°C
LOW VOLTAGE (3.3V CMOS) LOGIC - ALVC16
Example:
74ALVC16XXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74ALVC16XXX
D = Plastic SO
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
LOW VOLTAGE (3.3V CMOS) LOGIC - HLL
Example:
74HL33XXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74HL33XXX
D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
LOW VOLTAGE (3.3V CMOS) LOGIC - LV
Example:
74LVXXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74LVXXX
D = Plastic SO
DB = Shrink Small Outline (SSOP)
N = Plastic Dual In-Line
LOW VOLTAGE (3.3V CMOS) LOGIC - LVC
Example:
74LVCXXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74LVC16XXX
D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
相关PDF资料 |
PDF描述 |
|---|---|
| TDA1308T/N1,115 | 0.06 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
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| TDA1310AT-T | SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDSO8 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA1308TT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Class-AB stereo headphone driver |
| TDA1308TT/N1,118 | 功能描述:音频放大器 STEREO HEADPHONE DRIVER-TSSOP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1308TT/N2 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO .08W STER AB 8TSSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, .08W, STER, AB, 8TSSOP |
| TDA1308TT/N2,118 | 功能描述:音频放大器 STEREO HDPHON DRVR RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1308TT/N2118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 40mW TSSOP-8 |
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