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参数资料
| 型号： | TDA1308TD-G |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 0.06 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
| 封装： | PLASTIC, SO-8 |
| 文件页数： | 5/26页 |
| 文件大小： | 197K |
| 代理商： | TDA1308TD-G |
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PRODUCT LISTING EXPLANATION
Table 1
FAMILY PREFIX AND DEVICE TEMPERATURE
Table 2
PACKAGE DESCRIPTIONS
Prefix
A/WP
= Leaded Chip Carrier (PLCC)
ADC
AM
=
Alternate to National part number
Alternate to AMD part number
B/BB/BC/BE/BG
= Plastic Quad Flat Package(PQFP)
- Dry Pack handling required
AU
= Automotive -40° to +125°C
BD
= Low Profile quad Flat Package(LQFP)
DAC
= Alternate to P.M.I. part number
BF/BH/BK
= Shrink quad Flat Package(SQFP)
FB
= Futurebus+, 0°C to +70°C
D= Plastic Small Outline (SO/SOL)
ICM
= Alternate to lntersil part number
DB/DK/DL
= Shrink Small Outline Package (SSOP)
LF
= Alternate to National part number
F= Ceramic Dual In-Line
LM
= Alternate to National part number
FE
= Hermetic CERDIP - 8 lead
MB
= MULTIBYTE, -40'C to +85'C
GW
= Pcio Gate
MC
= Alternate to Motorola part number
M= Module
N, NE
= O°C to +70°C (O° to +75° C for 9300)
MSC
= Miscellaneous
P= Philips
N/P
= Plastic Dual In-Line (DIL)
PL
= Programmable Logic
PW/DH/DG/DGG
= Thin Shrink Small Outline Package (TSSOP)
PZ
= Programmable Logic/Philips Zero Power
NB
= 42 Pin Shrink Dual In-Line (DIL)
S/SC
= MCO Microcontroller
SC/SD
= Microprocessor Support
SA
= -40°C to +85° C
U= Plastic Single In-Line (SIL)
SE
= -55°C to +125°C
** The DH on PW and G on some DGG Part
SG
= Alternate to Silicon General part number
Package Codes have been removed due to
A
= Alternate to National part number
Space constraints in this price book.
Table 3 - PRODUCT FAMILY
ABBR
PRODUCT FAMILY
BIC
CLI
BiCMOS Logic
CMOS Logic (CLIC)
CON
DC
DSG
IND
Consumer Multimedia
Digital/Linear Data Comm/FB+
Discrete
Identification Contact
LIC
LOG
LV
Linear Industrial
Bipolar Logic
Low Voltage
MCO
Microprocessor, Microcontrollers,
CRT (Sunnyvale)
MM
MOS
Multimedia
MOS Microcontrollers/Hamburg
MST
PDI
PLD
PRM
RF
TEL
Mass Storage/Motor Control
Philips Digital Interface
Programmable Logic Devices
Proms
Wireless/RF Products
Telecom
Table 4 - COLUMN HEADING EXPLANATIONS
PART
NUMBER
CROSS REF.
PRD
FAM
PRODUCT
DESCRIPTION
SPQ
P/C
N74F244D
LOG
Octal Buffer 3 State
1520
20
N74F244D-T
LOG
Octal Buffer 3 State
1000
N74F244N
Product Family-
See Table 3
Pin Count
Description of Product
Quantity per
tube/reel/box
Industry Standard Part Number
-Complexity of LOG Parts
-Product Discontinuation Notice (DN-##)
-Dry Pack Indicator
Special Packaging Alternatives - see following page
Package Code - See Table 2
Device Number
Family Prefix and Device Temperature - See Table 1
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相关代理商/技术参数 |
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| TDA1308TT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Class-AB stereo headphone driver |
| TDA1308TT/N1,118 | 功能描述:音频放大器 STEREO HEADPHONE DRIVER-TSSOP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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| TDA1308TT/N2,118 | 功能描述:音频放大器 STEREO HDPHON DRVR RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1308TT/N2118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 40mW TSSOP-8 |
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