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| 型号： | TDA6650ATT/C3 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO38 |
| 封装： | 4.40 MM, 0.50 MM PITCH, PLASTIC, MO-153, SOT510-1, TSSOP-38 |
| 文件页数： | 46/54页 |
| 文件大小： | 325K |
| 代理商： | TDA6650ATT/C3 |
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TDA6650ATT_6651ATT_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 2 February 2007
50 of 54
NXP Semiconductors
TDA6650ATT; TDA6651ATT
5 V mixer/oscillator and low noise PLL synthesizer
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 32) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 28 and 29
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 32.
Table 28.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 29.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA6650TT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and low noise PLL synthesizer for hybrid terrestrial tuner (digital and analog) |
| TDA6650TT/C3 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and low noise PLL synthesizer for hybrid terrestrial tuner (digital and analog) |
| TDA6650TT/C3/S2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and low noise PLL synthesizer for hybrid terrestrial tuner (digital and analog) |
| TDA6651 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and low noise PLL synthesizer for hybrid terrestrial tuner (digital and analog) |
| TDA6651ATT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and low noise PLL synthesizer for hybrid terrestrial tuner (digital and analog) |
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