参数资料
型号: TDA8005
厂商: NXP Semiconductors N.V.
英文描述: Low-Power Smart Card Coupler(低功耗智能卡藕合器)
中文描述: 低功耗智能卡器(低功耗智能卡藕合器)
文件页数: 13/32页
文件大小: 198K
代理商: TDA8005
1996 Sep 25
20
Philips Semiconductors
Product specication
Low-power smart card coupler
TDA8005
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDA
analog supply voltage
0
6.5
V
VDDD
digital supply voltage
0
6.5
V
Vn
all input voltages
0VDD + 0.5 V
In1
DC current into XTAL1, XTAL2, RX, TX,
RESET, INT1, P34, P37, P00 to P03,
P11 to P17, P20 to P23 and
TEST1 to TEST4
5mA
In2
DC current from or to AUX1, AUX2
10
+10
mA
In3
DC current from or to S1 to S5
30
+30
mA
In4
DC current into DELAY
5
+10
mA
In5
DC current from or to PRES
5+5
mA
In6
DC current from and to K0 to K5
5+5
mA
In7
DC current from or into ALARM
(according to option choice)
5+5
mA
Ptot
continuous total power dissipation
Tamb = 20 to +85°C
500
mW
Tstg
IC storage temperature
55
+150
oC
Ves
electrostatic discharge
on pins I/O, VCC,
RST, CLK and PRES
6+6
kV
on other pins
2+2
kV
Tj
Operating Junction Temp.
125
°C
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
from junction to ambient in free air
LQFP64
70
K/W
QFP44
60
K/W
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TDA8005H 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-power smart card coupler