参数资料
型号: TDA8005
厂商: NXP Semiconductors N.V.
英文描述: Low-Power Smart Card Coupler(低功耗智能卡藕合器)
中文描述: 低功耗智能卡器(低功耗智能卡藕合器)
文件页数: 15/32页
文件大小: 198K
代理商: TDA8005
1996 Sep 25
22
Philips Semiconductors
Product specication
Low-power smart card coupler
TDA8005
Reset output to the card (RST)
Vinactive
output voltage
when inactive
0.3
0.4
V
when LIS is used; Iinactive =1mA
0.3
0.4
V
Iinactive
current from RST when
inactive and pin grounded
1mA
VOL
LOW level output voltage
IOL = 200 A
0.25
0.4
V
VOH
HIGH level output voltage
IOH <200 A4
VCC + 0.3 V
tr
rise time
CL =30pF
1
s
tf
fall time
CL =30pF
1
s
Clock output to the card (CLK)
Vinactive
output voltage
when inactive
0.3
0.4
V
when LIS is used; Iinactive =1mA
0.3
0.4
V
Iinactive
current from CLK when
inactive and pin grounded
1mA
VOL
LOW level output voltage
IOL = 200 A
0.25
0.4
V
VOH
HIGH level output voltage
IOH <200 AVCC0.5
VCC+0.25 V
tr
rise time
CL =30pF
15
ns
tf
fall time
CL =30pF
15
ns
fclk
clock frequency
1 MHz Idle conguration
1
1.5
MHz
low operating speed
2
MHz
middle operating speed
4
MHz
high operating speed
8
MHz
δ
duty cycle
CL =30pF
45
55
%
Card supply voltage (VCC)
Vinactive
output voltage
when inactive
0.3
0.4
V
when LIS is used; Iinactive =1mA
0.3
0.4
V
Iinactive
current from VCC when
inactive and pin grounded
1mA
Vcc
output voltage in active mode
with 100 nF capacitor;
static load (up to 20 mA)
dynamic current of 40 nA
Imax = 200 mA, fmax = 5 MHz, and
duration <400 ns
4.75
4.5
5.25
5.5
V
ICC
output current
VCC = 5V
20
mA
VCC shorted to GND
40
mA
SR
slew rate
up or down
(max capacitance is 150 nF)
0.04
0.1
0.16
V/
s
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
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