参数资料
型号: TDA8006
厂商: NXP Semiconductors N.V.
英文描述: Multiprotocol IC Card Coupler(多协议的IC卡耦合器)
中文描述: 多协议IC卡器(多协议的集成电路卡耦合器)
文件页数: 20/40页
文件大小: 166K
代理商: TDA8006
2000 Feb 21
27
Philips Semiconductors
Product specication
Multiprotocol IC Card coupler
TDA8006
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDA
analog supply voltage
0.5
+6.5
V
VDDD
digital supply voltage
0.5
+6.5
V
Vn1
all input voltages except S1, S2 and VUP
0.5
VDD + 0.5 V
Vn2
voltage on pins S1, S2 and VUP
0.5
+7.5
V
In1
DC current into XTAL1, XTAL2, P30/RXD,
P31/TXD, RESET, P33/INT1, P36/WR,
P37/RD, P00 to P07, P20 to P27, P10/T2,
P11/T2EX, EA, ALE, PSEN, CDELAY, PRES,
INHIB, CLKOUT and TEST
5+5
mA
In3
DC current from or to pins S1, S2 and VUP
200
+200
mA
In6
DC current from or to K0 to K3
5+5
mA
In7
DC current from or into pin ALARM
(according to option choice)
see Table 12
5+5
mA
Ptot
total power dissipation
Tamb = 20 to +85 °C
QFP44
400
mW
QFP64
500
mW
Tstg
storage temperature
55
+150
°C
Tj
junction temperature
140
°C
Vesd
electrostatic discharge
on pins I/O, VCC
RST, CLK, C4, C8
and PRES
6+6
kV
on other pins
2+2
kV
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air
QFP64
51
K/W
QFP44
64
K/W
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