参数资料
型号: TDA8006
厂商: NXP Semiconductors N.V.
英文描述: Multiprotocol IC Card Coupler(多协议的IC卡耦合器)
中文描述: 多协议IC卡器(多协议的集成电路卡耦合器)
文件页数: 24/40页
文件大小: 166K
代理商: TDA8006
2000 Feb 21
30
Philips Semiconductors
Product specication
Multiprotocol IC Card coupler
TDA8006
Card supply voltage (pin VCC); note 3
VO(VCC)
card supply output voltage
inactive
no load
0
0.1
V
IO(VCC) =1mA
0
0.3
V
pin grounded
0
1mA
active
ICC < 65 mA; 5 V card
4.75
5
5.25
V
ICC < 65 mA; 3 V card
2.8
3
3.2
V
current pulses of 40 nAs with
ICC < 200 mA; t < 400 ns;
f < 20 MHz; 5 V card
4.6
5.4
V
current pulses of 24 nAs with
ICC < 200 mA; t < 400 ns;
f < 20 MHz; 3 V card
2.75
3.25
V
IO(VCC)
card supply output current
from 0 to 3 or 5 V
65
mA
VCC short circuited to GND
250
mA
ICC(sd)
shutdown current at pin VCC
80
mA
SR
slew rate
up or down
(capacitor = 100 to 300 nF)
0.10
0.16
0.22
V/
s
Data line (pin I/O); note 4
Vo(I/O)
output voltage
inactive
no load
0
0.1
V
Io(I/O) =1mA
0.3
V
Io(I/O)
output current
inactive and pin grounded
0
1mA
VOL
LOW-level output voltage
I/O congured as output;
IOL =1mA
0
0.3
V
VOH
HIGH-level output voltage
I/O congured as output;
IOH < 50 A
0.8VCC
VCC + 0.25 V
VIL
LOW-level input voltage
I/O congured as input
0.3
+0.8
V
VIH
HIGH-level input voltage
I/O congured as input
1.5
VCC
V
IIL
LOW-level input current
VIL =0 V
600
A
ILIH
HIGH-level input leakage
current
VIH =VCC
20
A
ti(r)
input rise time
CL =30pF
1
s
ti(f)
input fall time
CL =30pF
1
s
to(r)
output rise time
CL =30pF
0.1
s
to(f)
output fall time
CL =30pF
0.1
s
Rpu(int)
internal pull-up resistance
between I/O and VCC
810
13
k
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
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