- 您现在的位置：买卖IC网 > PDF目录19516 > TEA1506T/N1,118 (NXP Semiconductors)IC CTLR SMPS PS SW MODE 14SOIC PDF资料下载
参数资料
| 型号： | TEA1506T/N1,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 19/22页 |
| 文件大小： | 0K |
| 描述： | IC CTLR SMPS PS SW MODE 14SOIC |
| 标准包装： | 2,500 |
| 系列： | GreenChip™ II |
| 输出隔离： | 隔离 |
| 频率范围： | 25kHz ~ 175kHz |
| 输入电压： | 8.7 V ~ 20 V |
| 输出电压： | 650V |
| 功率（瓦特）： | 750mW |
| 工作温度： | -20°C ~ 145°C |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SO |
| 包装： | 带卷 (TR) |
Philips Semiconductors
GreenChip ? II SMPS control IC
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
Through-hole mount packages
S OLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 ° C or 265 ° C, depending on solder
material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T stg(max) ). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
M ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 ° C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 ° C, contact may be up to 5 seconds.
Surface mount packages
R EFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
2003 Sep 09
19
Product speci?cation
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270 ° C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
? below 220 ° C (SnPb process) or below 245 ° C (Pb-free
process)
– for all the BGA and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm 3 so called thick/large packages.
? below 235 ° C (SnPb process) or below 260 ° C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm 3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
W AVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
? Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
? For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
? For packages with leads on four sides, the footprint must
be placed at a 45 ° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
相关PDF资料 |
PDF描述 |
|---|---|
| RBM10DCTS | CONN EDGECARD 20POS DIP .156 SLD |
| NMPD0103C | POWER OVER ETHERNET MODULE |
| R15P212S/X2/P/R6.4 | CONV DC/DC 2W 15VIN 12VOUT |
| NPH10S2415IC | CONV DC/DC 10W24VIN 15.1VOUT DIP |
| VE-BT0-CW-B1 | CONVERTER MOD DC/DC 5V 100W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TEA1507 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:GreenChipII SMPS control IC |
| TEA1507P | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:GreenChipII SMPS control IC |
| TEA1507P/N1,112 | 功能描述:转换 - 电压电平 SMPS GREENCHIP II RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| TEA1520 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:STARplug |
| TEA1520P | 制造商:STMicroelectronics 功能描述:NXP IC 8-PIN DIP |
发布紧急采购，3分钟左右您将得到回复。