- 您现在的位置：买卖IC网 > PDF目录19516 > TEA1506T/N1,118 (NXP Semiconductors)IC CTLR SMPS PS SW MODE 14SOIC PDF资料下载
参数资料
| 型号： | TEA1506T/N1,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 20/22页 |
| 文件大小： | 0K |
| 描述： | IC CTLR SMPS PS SW MODE 14SOIC |
| 标准包装： | 2,500 |
| 系列： | GreenChip™ II |
| 输出隔离： | 隔离 |
| 频率范围： | 25kHz ~ 175kHz |
| 输入电压： | 8.7 V ~ 20 V |
| 输出电压： | 650V |
| 功率（瓦特）： | 750mW |
| 工作温度： | -20°C ~ 145°C |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SO |
| 包装： | 带卷 (TR) |
Philips Semiconductors
GreenChip ? II SMPS control IC
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 ° C or 265 ° C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Product speci?cation
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
M ANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 ° C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 ° C.
Suitability of IC packages for wave, re?ow and dipping soldering methods
MOUNTING
PACKAGE (1)
SOLDERING METHOD
WAVE REFLOW (2) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable (3)
?
suitable
Through-hole-
PMFP (9)
not suitable
not suitable
?
surface mount
Surface mount
BGA, LBGA, LFBGA, SQFP, SSOP-T (4) ,
not suitable
suitable
?
TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
not suitable (5)
suitable
?
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
PLCC (6) , SO, SOJ
suitable
suitable
?
LQFP, QFP, TQFP
not
recommended (6)(7)
suitable
?
SSOP, TSSOP, VSO, VSSOP
not recommended (8)
suitable
?
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 ° C ± 10 ° C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
6. If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2003 Sep 09
20
相关PDF资料 |
PDF描述 |
|---|---|
| RBM10DCTS | CONN EDGECARD 20POS DIP .156 SLD |
| NMPD0103C | POWER OVER ETHERNET MODULE |
| R15P212S/X2/P/R6.4 | CONV DC/DC 2W 15VIN 12VOUT |
| NPH10S2415IC | CONV DC/DC 10W24VIN 15.1VOUT DIP |
| VE-BT0-CW-B1 | CONVERTER MOD DC/DC 5V 100W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TEA1507 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:GreenChipII SMPS control IC |
| TEA1507P | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:GreenChipII SMPS control IC |
| TEA1507P/N1,112 | 功能描述:转换 - 电压电平 SMPS GREENCHIP II RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| TEA1520 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:STARplug |
| TEA1520P | 制造商:STMicroelectronics 功能描述:NXP IC 8-PIN DIP |
发布紧急采购，3分钟左右您将得到回复。