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| 型号： | TEA5766UK/N1/S21,0 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 接收器 |
| 英文描述： | FM, AUDIO SINGLE CHIP RECEIVER, PBGA25 |
| 封装： | 3.30 X 3.25 MM, 0.60 MM HEIGHT, WLCSP-25 |
| 文件页数： | 49/59页 |
| 文件大小： | 273K |
| 代理商： | TEA5766UK/N1/S21,0 |
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TEA5766UK_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 22 March 2007
53 of 59
NXP Semiconductors
TEA5766UK
Stereo FM radio + RDS
16. Soldering
16.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in Application Note
AN10439 “Wafer Level Chip Scale Package” and in Application Note AN10365 “Surface
mount reow soldering description”.
Wave soldering is not suitable for this package.
16.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reow soldering itself
16.3 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 23) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classied in accordance with Table 35 and 36
Table 35.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 36.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TEA5767 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:single-chip FM stereo radio |
| TEA5767HL | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-power FM stereo radio for handheld applications |
| TEA5767HN | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-power FM stereo radio for handheld applications |
| TEA5767HN/V3 | 功能描述:射频收发器 FM RECEIVER RoHS:否 制造商:Atmel 频率范围:2322 MHz to 2527 MHz 最大数据速率:2000 Kbps 调制格式:OQPSK 输出功率:4 dBm 类型: 工作电源电压:1.8 V to 3.6 V 最大工作温度:+ 85 C 接口类型:SPI 封装 / 箱体:QFN-32 封装:Tray |
| TEA5767HN/V3,118 | 功能描述:射频收发器 FM RECEIVER RoHS:否 制造商:Atmel 频率范围:2322 MHz to 2527 MHz 最大数据速率:2000 Kbps 调制格式:OQPSK 输出功率:4 dBm 类型: 工作电源电压:1.8 V to 3.6 V 最大工作温度:+ 85 C 接口类型:SPI 封装 / 箱体:QFN-32 封装:Tray |
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