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参数资料
| 型号： | TFP401CPZP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封装： | 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, POWER, THERMALLY ENHANCED, PLASTIC, TQFP-100 |
| 文件页数： | 19/22页 |
| 文件大小： | 285K |
| 代理商： | TFP401CPZP |
TFP401, TFP401A
TI PanelBus
DIGITAL RECEIVER
SLDS120 - MARCH 2000
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
I/O
DESCRIPTION
Rx2-
81
AI
Channel-2 negative receiver input – Negative side of channel-2 TMDS low voltage signal differential input pair.
SCDT
8
DO
Sync detect – Output to signal when the link is active or inactive. The link is considered to be active when DE is
actively switching. The TFP401/401A monitors the state DE to determine link activity. SCDT can be tied
externally to PDO to power down the output drivers when the link is inactive.
High: Active link
Low: Inactive link
ST
3
DI
Output drive strength select – Selects output drive strength for high or low current drive. (See dc specifications
for IOH and IOL vs ST state.)
High : High drive strength
Low : Low drive strength
STAG
7
DI
Staggered pixel select – An active low signal used in the 2-pixel/clock pixel mode (PIXS = high). Time staggers
the even and odd pixel outputs to reduce ground bounce. Normal operation outputs the odd and even pixels
simultaneously.
High : Normal simultaneous even/odd pixel output
Low: Time staggered even/odd pixel output
VSYNC
47
DO
Vertical sync output
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, DVDD, AVDD, OVDD, PVDD
-0.3 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, logic/analog signals
-0.3 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating ambient temperature range
0
°C to 70°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range
- 65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package power dissipation/PowerPAD: Soldered (see Note 1)
4.3 W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Not soldered (see Note 2)
2.7 W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Protection, all pins
2 KV Human Body Model
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JEDEC latchup (EIA/JESD78)
100 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Specified with PowerPAD bond pad on the backside of the package soldered to a 2 oz. Cu plate PCB thermal plane. Specified at
maximum allowed operating temperature, 70
°C.
2. PowerPAD bond pad on the backside of the package is not soldered to a thermal plane. Specified at maximum allowed operating
temperature, 70
°C.
ADV
ANCE
INFORMA
TION
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