参数资料
型号: TFP401CPZP
厂商: TEXAS INSTRUMENTS INC
元件分类: 消费家电
英文描述: SPECIALTY CONSUMER CIRCUIT, PQFP100
封装: 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, POWER, THERMALLY ENHANCED, PLASTIC, TQFP-100
文件页数: 8/22页
文件大小: 285K
代理商: TFP401CPZP
TFP401, TFP401A
TI PanelBus
DIGITAL RECEIVER
SLDS120 - MARCH 2000
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
detailed description (continued)
POWER MODE
IDD
NOTES
Normal Mode
PIX = Low
TBD
Normal operation pixel rate = 165 MHz
1-pixel/clock
Normal Mode
PIX = High
TBD
Normal operation pixel rate = 165 MHz
2-pixel/clock (ODCK = 82.5 MHz)
Power Down
PD = Low
TBD
System power down.
All outputs are Hi-Z with a weak pulldown (10
A) to ground
All inputs are disabled except PD
Output driver power down PDO= Low
TBD
Cable connected and link is inactive (Can use SCDT to drive PDO)
All outputs except SCDT and CTL1 are Hi-Z with a weak pulldown (10
A) to
ground.
IDD is the calculated as the sum of all VDD power supply currents (AVDD, DVDD, OVDD, PVDD)
Measured when cable is disconnected from inputs.
Both PDO and PD have internal pullups so if left unconnected they will default the TFP401/401A to normal
operating modes.
The TFP401/401A power down (PD = low) is a complete power downin that it powers down the digital core, the
analog circuitry, and output drivers. All output drivers are placed into a Hi-z state with a weak pulldown (10
A)
to ground. All inputs are disabled except for the PD input. The TFP401/401A will not respond to any digital or
analog inputs until PD is pulled high.
Sync Detect. The TFP401/401A offers an output, SCDT to indicate link activity. The TFP401/401A monitors
activity on DE to determine if the link is active. When 1 million (1e6) pixel clock periods pass without a transition
on DE, the TFP401/401A considers the link inactive and SCDT is driven low. While SCDT is low, if two DE
transitions are detected within 1600 pixel clock periods, the link will be considered active and SCDT is pulled
high.
SCDT can be used to signal a system power management circuit to initiate a system power down when the link
is considered inactive. The SCDT can also be tied directly to the TFP401/401A PDO input to power down the
output drivers when the link is inactive. It is not recommended to use the SCDT to drive the PD input since, once
in complete power-down, the analog inputs are ignored and the SCDT state will not change. An external system
power management circuit to drive PD is preferred.
TI PowerPAD 100-TQFP package
The TFP401/401A is packaged in TI’s thermally enhanced PowerPAD 100TQFP packaging. The PowerPAD
package is a 14 mm
× 14 mm × 1.4 mm TQFP outline with 0.5mm lead-pitch. The PowerPAD package has a
specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the
same outline. The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly to
the die mount pad for enhanced thermal conduction. The system designer has the option to solder this back
side plane to a thermal/ground plane on the PCB. Since the die pad is electrically connected to the TFP401/401A
chip substrate and hence ground, the back side PowerPAD connection to a PCB ground plane can improve
ground bounce and power-supply noise.
The connection of the PowerPAD to a PCB thermal/ground plane is purely optional. However, improved ground
bounce, reduced EMI and performance at pixel rates above 165 MHz may be possible.
ADV
ANCE
INFORMA
TION
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