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| 型号： | TLC071AIPE4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 运算放大器 |
| 英文描述： | OP-AMP, 2000 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDIP8 |
| 封装： | ROHS COMPLIANT, PLASTIC, DIP-8 |
| 文件页数： | 15/53页 |
| 文件大小： | 1664K |
| 代理商： | TLC071AIPE4 |
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TLC070, TLC071, TLC072, TLC073, TLC074, TLC075, TLC07xA
FAMILY OF WIDEBANDWIDTH HIGHOUTPUT DRIVE SINGLE SUPPLY
OPERATIONAL AMPLIFIERS
SLOS219E JUNE 1999 REVISED SEPTEMBER 2006
22
WWW.TI.COM
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
APPLICATION INFORMATION
general PowerPAD design considerations
The TLC07x is available in a thermally-enhanced PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This
arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see
Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance
can be achieved by providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
Soldering the PowerPAD to the PCB is always required, even with applications that have low-power dissipation.
This provides the necessary thermal and mechanical connection between the lead frame die pad and the PCB.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 52. Views of Thermally-Enhanced DGN Package
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TLC071CD | 功能描述:运算放大器 - 运放 High Speed R/R RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| TLC071CD | 制造商:Texas Instruments 功能描述:OP AMP HI SPEED RRIO SMD SOIC8 |
| TLC071CDG4 | 功能描述:运算放大器 - 运放 Sngl Wide-Bandwidth Hi-Output-Drv Op Amp RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| TLC071CDGN | 功能描述:运算放大器 - 运放 Sngl Wide-Bandwidth Hi-Output-Drv Op Amp RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| TLC071CDGNG4 | 功能描述:运算放大器 - 运放 Sngl Wide-Bandwidth Hi-Output-Drv Op Amp RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
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