参数资料
| 型号： | TLE8263E |
| 厂商： | Infineon Technologies |
| 文件页数： | 2/16页 |
| 文件大小： | 0K |
| 描述： | IC SYSTEM BASIS CHIP DSO-36 |
| 标准包装： | 1,000 |
| 类型： | 收发器 |
| 应用： | 自动 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 36-BSSOP（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | PG-DSO-36 |
| 包装： | 带卷 (TR) |
| 其它名称： | SP000317795 TLE8263EFUMA1 TLE8263EXUMA1 |
System Basis Chips
I NFINE ON h AS DEVEL OPED several integrated
components to enable the design of cost-effective, robust and
high-performance modules, to meet the harsh requirements of
the automotive industry for quiescent current, system area and
costs.
A S A WELL - E S T ABLIS h ED automotive supplier,
Infineon combines its experience with a wide portfolio of tran-
sceivers, voltage regulators, high side and low side switches,
to design standard integrated solutions meeting the specific
demands of its customers.
Th E FLE x IBILIT y and performance of the SPT
technology allows Infineon to use a systematic cell block
approach, up-integrating already approved and qualified
circuits. This allows a fast and reliable concept phase, and
reduces the product time to market.
Customer’s Benefit
uSING A S T AND A r D integrated solution, reduces
the design-in time significantly. The hardware is herewith
simplified, and the software can be adapted to fit to new
requirements, enabling an efficient reuse of the running
designs.
A VE ry L O W quiescent current is achieved, because
all the functions requiring a permanent connection to
the battery are integrated in one chip. The system cost can
be significantly reduced due to the fact that none of the
additional external components required in a discrete solution
are needed.
I NTE G r A TED F u NCTIONS including low battery
early warning, window watchdog, temperature warning flag
and over-temperature protection, meet the increasing need
for safety in the applications, with a minimum increase of
cost or system area.
Th E DEVIC E S CAN W O rk within wide battery
voltage and temperature ranges. Fail-safe outputs allow
the implementation of a “limp-home” hardware, in case of
malfunctions in the vehicle.
Th E I NFINE ON P r OD u CT PO r TFOLIO offers
a wide range of protocols currently used by OEMs, high Speed
CAN, Low Speed Fault Tolerant CAN and LIN. All products fit
the relevant ISO standard and have ICT certification.
10
Typical car application
5 V LDO
Common function
of any automotive
module
Supervision
CAN
LIN
SBC
Microcontroller
Switches
Bridges
Sensor
Application
dependent
08-01-16 RZ Transceiver Gesamt.indd 10
16.01.2008 12:23:36 Uhr
相关PDF资料 |
PDF描述 |
|---|---|
| TLE8262E | IC SYSTEM BASIS CHIP DSO-36 |
| TLE8261E | IC SYSTEM BASIS CHIP DSO-36 |
| DS2413P+T&R | IC SWITCH DL ADDRESS 6TSOC |
| LFXP15C-3F388I | IC FPGA 15.5KLUTS 268I/O 388-BGA |
| LFXP15E-3FN388I | IC FPGA 15.4KLUTS 388FPBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TLE8263EFUMA1 | 制造商:Infineon Technologies AG 功能描述:System Basis Chip 36-Pin DSO EP T/R |
| TLE8263EXUMA1 | 功能描述:CAN 接口集成电路 BODY SYSTEM ICS RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| TLE8263EXUMA2 | 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:Universal System Basis Chip |
| TLE8264-2E | 功能描述:处理器 - 专门应用 BODY SYSTEM ICS RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432 |
| TLE82642EXUMA1 | 制造商:Infineon Technologies AG 功能描述:Enhanced Power Package T/R 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:IC SYSTEM BASIS CHIP DSO-36 |
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