参数资料
型号: TLE8263E
厂商: Infineon Technologies
文件页数: 3/16页
文件大小: 0K
描述: IC SYSTEM BASIS CHIP DSO-36
标准包装: 1,000
类型: 收发器
应用: 自动
安装类型: 表面贴装
封装/外壳: 36-BSSOP(0.295",7.50mm 宽)裸露焊盘
供应商设备封装: PG-DSO-36
包装: 带卷 (TR)
其它名称: SP000317795
TLE8263EFUMA1
TLE8263EXUMA1
The Low Speed CAN SBCs
A S A PIONEE r of System Basis Chips solutions,
Infineon has offered SBCs with Fault Tolerant Low Speed CAN
interface since 1998, dedicated to body and convenience
modules. The products below benefit from the performances
of the latest transceiver cell generation.
TLE6263-3G – the universal body IC
Th E TLE6 26 3- 3G meets the main smart power and
supply requirements, among the most important features:
Fault Tolerant Low Speed CAN transceiver
Voltage regulator (5 V / 150 mA)
1 high Side driver (150 mA)
Local wake-up pin(s)
Window watchdog
TLE6266G – the dedicated door module IC
Th E TLE6 266G reflects the specific needs for door
module control, offering:
Fault Tolerant Low Speed CAN transceiver
Voltage regulator (5 V / 45 mA)
2 Low Side drivers
3 high Side drivers
Local wake-up pin(s)
Window watchdog
11
Block diagram TLE6266G
RTH
RTL
CANL
CANH
VS
PWM
CSN
CLK
DI
DO
RO
WK
TxD
RxD
GND
VCC
-
+
LDO
Input
stage
VCC
VS
OUTL1
OUTL2
OUTH1
OUTH2
OUTH3
Charge
pump
Filter
Receiver
Drive
H Output stage
L Output stage
CAN fail defect
UVLO
Protection + Drive
Band
gap
VCC
Temp.
protect
Driver
Fa
il
m
an
ag
em
en
t
Reset
generator
+
Window
watchdog
Switch
fall defect
Mode control
Timer Oscillator
SPI
08-01-16 RZ Transceiver Gesamt.indd 11
16.01.2008 12:23:37 Uhr
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相关代理商/技术参数
参数描述
TLE8263EFUMA1 制造商:Infineon Technologies AG 功能描述:System Basis Chip 36-Pin DSO EP T/R
TLE8263EXUMA1 功能描述:CAN 接口集成电路 BODY SYSTEM ICS RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube
TLE8263EXUMA2 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:Universal System Basis Chip
TLE8264-2E 功能描述:处理器 - 专门应用 BODY SYSTEM ICS RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
TLE82642EXUMA1 制造商:Infineon Technologies AG 功能描述:Enhanced Power Package T/R 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:IC SYSTEM BASIS CHIP DSO-36