参数资料
| 型号： | TLK2501EVM |
| 厂商： | Texas Instruments |
| 文件页数： | 10/54页 |
| 文件大小： | 0K |
| 描述： | EVALUATON MOD FOR TLK2501 |
| 标准包装： | 1 |
| 主要目的： | 接口，SerDes（串行器 / 解串器） |
| 已用 IC / 零件： | TLK2501 |
| 已供物品： | 板 |
| 相关产品： | TLK2501IRCPRG4-ND - IC TRNSCVR 1.5-2.5GBPS 64HVQFP TLK2501IRCPR-ND - IC TRNSCVR 1.5-2.5GBPS 64-HVQFP TLK2501IRCPG4-ND - IC TRNSCVR 1.5-2.5GBPS 64-HVQFP 296-10488-ND - IC TRNSCVR 1.6-2.5GBPS 64-HVQFP |
| 其它名称： | 296-31395 TLK2501EVM-ND |
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Introduction
1.1 Introduction
The TLK2501 EVM board can be used to evaluate device parameters while
acting as a guide for high-speed board layout. The evaluation board can be
used as a daughter board that is plugged into new or existing designs. Since
the TLK2501 operates over a wide range of frequencies, designers need to
optimize designs for the frequency of interest. Additionally, designers may
wish to use buried transmission lines and provide additional noise attenuation
and EMI suppression to optimize their end product.
As the frequency of operation increases, the board designer must take special
care to ensure that the highest signal integrity is maintained. To achieve this,
the board’s impedance is controlled to 50 ? for both the high-speed differential
serial and parallel data connections. In addition, impedance mismatches are
reduced by designing the component pad size to be as close as possible to
the width of the connecting transmission lines. Vias are minimized and, when
necessary, placed as close as possible to the device drivers. Since the board
contains both serial and parallel transmission lines, care was taken to control
both impedance and trace length mismatch (board skew).
Overall, the board layout is designed and optimized to support high-speed
operation. Thus, understanding impedance control and transmission line
effects are crucial when designing high-speed boards.
Some of the advanced features offered by this board include:
PCB (printed-circuit board) is designed for high-speed signal integrity.
Flexibility–The PCB can be configured for copper or optical interfaces.
SMA and parallel fixtures are easily connected to test equipment.
All input/output signals are accessible for rapid prototyping.
Analog and digital power planes can be supplied through separate banana
jacks for isolation or can be combined using ferrite bridging networks.
Series termination resistors provide parallel RD outputs.
Onboard capacitors provide ac coupling of high-speed signals.
1.2 TLK2501 EVM Kit Contents
TLK2501 EVM board
TLK2501 EVM kit documentation (This document)
1-2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TLK2501IRCP | 功能描述:以太网 IC 1.5 to 2.5 Gbps Transceiver RoHS:否 制造商:Micrel 产品:Ethernet Switches 收发器数量:2 数据速率:10 Mb/s, 100 Mb/s 电源电压-最大:1.25 V, 3.45 V 电源电压-最小:1.15 V, 3.15 V 最大工作温度:+ 85 C 封装 / 箱体:QFN-64 封装:Tray |
| TLK2501IRCPG4 | 功能描述:以太网 IC 1.5 to 2.5 Gbps Transceiver RoHS:否 制造商:Micrel 产品:Ethernet Switches 收发器数量:2 数据速率:10 Mb/s, 100 Mb/s 电源电压-最大:1.25 V, 3.45 V 电源电压-最小:1.15 V, 3.15 V 最大工作温度:+ 85 C 封装 / 箱体:QFN-64 封装:Tray |
| TLK2501IRCPR | 功能描述:以太网 IC 1.5 to 2.5 Gbps Transceiver RoHS:否 制造商:Micrel 产品:Ethernet Switches 收发器数量:2 数据速率:10 Mb/s, 100 Mb/s 电源电压-最大:1.25 V, 3.45 V 电源电压-最小:1.15 V, 3.15 V 最大工作温度:+ 85 C 封装 / 箱体:QFN-64 封装:Tray |
| TLK2501IRCPRG4 | 功能描述:以太网 IC 1.5 to 2.5 Gbps Transceiver RoHS:否 制造商:Micrel 产品:Ethernet Switches 收发器数量:2 数据速率:10 Mb/s, 100 Mb/s 电源电压-最大:1.25 V, 3.45 V 电源电压-最小:1.15 V, 3.15 V 最大工作温度:+ 85 C 封装 / 箱体:QFN-64 封装:Tray |
| TLK2521 | 制造商:TI 制造商全称:Texas Instruments 功能描述:1 to 2.5 Gbps TRANSCEIVER |
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